Manufacturer Part Number:

IXFN82N60P

OneIC Part Number:
184-IXFN82N60P
Manufacturer:

IXYS

microsemi
Description:
MOSFET DIODE Id82 BVdass600
Customer Reference:
Datasheet:

Image shown is a representation only. Exact specifications should be obtained from the product datasheet.

Product Attributes

Type Description
Maximum Gate Source Voltage ±30
EU RoHS Compliant
Maximum Operating Temperature 150
Channel Mode Enhancement
Standard Package Name SOT-227
Mounting Screw
Maximum Power Dissipation 1040000
Channel Type N
Maximum Drain Source Resistance 75@10V
Minimum Operating Temperature -55
Maximum Drain Source Voltage 600
Number of Elements per Chip 1
Package Width 25.42(Max)
Supplier Package SOT-227B
Package Length 38.23(Max)
PCB 4
Maximum Continuous Drain Current 72
Pin Count 4
Lead Shape Screw
FET Feature Standard
Packaging Tube
Mounting Type Chassis Mount
Current - Continuous Drain (Id) @ 25° C 72A
Vgs(th) (Max) @ Id 5V @ 8mA
Drain to Source Voltage (Vdss) 600V
Supplier Device Package SOT-227B
Rds On (Max) @ Id, Vgs 75 mOhm @ 41A, 10V
FET Type MOSFET N-Channel, Metal Oxide
Power - Max 1040W
Standard Package 10
Input Capacitance (Ciss) @ Vds 23000pF @ 25V
Gate Charge (Qg) @ Vgs 240nC @ 10V
Package/Case SOT-227-4, miniBLOC
rohs Lead free / RoHS Compliant
Category Power MOSFET
Configuration Dual Source, Single
Dimensions 38.2 x 25.07 x 9.6mm
Height 9.6mm
Length 38.2mm
Maximum Continuous Drain Current 72 A
Maximum Drain Source Resistance 0.075 Ω
Maximum Drain Source Voltage 600 V
Maximum Gate Source Voltage ±30 V
Maximum Operating Temperature +150 °C
Maximum Power Dissipation 1040 W
Minimum Operating Temperature -55 °C
Package Type SOT-227B
Typical Gate Charge @ Vgs 240 nC V @ 10
Typical Input Capacitance @ Vds 23000 pF V @ 25
Typical Turn-Off Delay Time 79 ns
Typical Turn-On Delay Time 28 ns
Width 25.07mm
Factory Pack Quantity 10
Transistor Polarity N-Channel
Continuous Drain Current 72 A
Package / Case SOT-227B-4
Fall Time 24 ns
Product Category MOSFET
Unit Weight 1.340411 oz
Tradename Polar, HiPerFET
Forward Transconductance - Min 50 s
RoHS RoHS Compliant
Gate-Source Breakdown Voltage +/- 30 V
Series IXFN82N60
Rds On 75 mOhms
Mounting Style SMD/SMT
Power Dissipation 1.04 kW
Rise Time 23 ns
Drain-Source Breakdown Voltage 600 V
Gate Charge Qg 240 nC
高度 9.6mm
晶体管材料 Si
类别 功率 MOSFET
长度 38.2mm
典型输入电容值@Vds 23000 pF@ 25 V
通道模式 增强
安装类型 面板安装
每片芯片元件数目 1
最大漏源电阻值 75 mΩ
通道类型 N
Board Level Components Y
最高工作温度 +150 °C
最大栅阈值电压 5V
最低工作温度 -55 °C
最大功率耗散 1040000 mW
最大栅源电压 ±30 V
宽度 25.07mm
尺寸 38.2 x 25.07 x 9.6mm
最大漏源电压 600 V
典型接通延迟时间 28 ns
典型关断延迟时间 79 ns
封装类型 SOT-227B
最大连续漏极电流 72 A
引脚数目 4
晶体管配置
典型栅极电荷@Vgs 240 nC @ 10 V
Vds - Drain-Source Breakdown Voltage 600 V
Vgs - Gate-Source Voltage 30 V
Vgs th - Gate-Source Threshold Voltage 5 V
Qg - Gate Charge 240 nC
Type Polar HiPerFET Power MOSFET
Brand IXYS
Number of Channels 1 Channel
Transistor Type 1 N-Channel
Id - Continuous Drain Current 72 A
Rds On - Drain-Source Resistance 75 mOhms
Pd - Power Dissipation 1.04 kW
Technology Si

Documents & Media

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Datasheets IXFN82N60P
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