Image shown is a representation only. Exact specifications should be obtained from the product datasheet.
| Type | Description |
|---|---|
| Type | SCSI |
| Gender | RCP |
| Pitch | 2.54 mm |
| Termination Method | Solder |
| Mounting | Through Hole |
| Body Orientation | Right Angle |
| Standard Package | Trays |
| PCB Polarization | Without |
| PCB Mount Angle | Right Angle |
| Housing Material | Liquid Crystal Polymer (LCP) |
| PCB Mount Style | Thru Hole |
| Number of Positions | 50 |
| Profile | Standard |
| Lead Free Solder Processes | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
| Product Series | Series I |
| Centerline (mm (in)) | 1.27 [0.050] |
| Solder Tail Contact Plating | Tin |
| Brand | AMP |
| Product Type | Connector |
| Boardlock Plating | Tin |
| RoHSELV Compliance | RoHS compliant, ELV compliant |
| PCB Retention Feature | Yes |
| Connector Type | Series I |
| Housing Temperature Rating | High |
| Contact Mating Area Plating Material | Gold (30) |
| PCB Retention Method | Boardlock(s) |
| Housing Flammability Rating | UL 94V-0 |
| Sealed Bottom | Without |
| Boardlock Material | Brass |
| Color | Black |
| Used For | Board To Board Applications |
| Contact Material | Phosphor Bronze |
| RoHSELV Compliance History | Always was RoHS compliant |
| Termination (Solder) Post Length (mm (in)) | 3.10 [0.122] |
| Features | Board Lock |
| Mounting Type | Through Hole, Right Angle |
| Contact Finish | Gold |
| Number of Rows | 2 |
| Termination | Solder |
| Contact Finish Thickness | Flash |
| Connector Style | Outer Shroud Contacts |
| rohs | Lead free / RoHS Compliant |
| Factory Pack Quantity | 350 |
| Mounting Angle | Right |
| Product Category | Board to Board & Mezzanine Connectors |
| Series | I Hi-Temp |
| Termination Style | Through Hole |
| Packaging | Bulk |
| Number of Positions / Contacts | 50 |
| Contact Plating | Gold |
| RoHS | RoHS Compliant |
| Standard Pack: | 35 |
| 连接器类型 | Receptacle |
| 排数 | 2 |
| 位置数 | 50 |
| 端接 | Solder |
| 连接器样式 | Outer Shroud Contacts |
| 特性 | Board Lock |
| 触头镀层 | Gold |
| 触头镀层厚度 | Flash |
| 类型 | Board to Board |
| 可堆叠 | 否 |
| Centerline (Pitch) | 1.27 mm [ .05 in ] |
| 适用于 | 插头组件 |
| 端子类型 | 插座 |
| PCB 安装固定类型 | 板锁 |
| 封装方法 | 托盘 |
| 绝缘电阻 (MΩ) | 1000 |
| 端子基材 | 磷青铜 |
| 板锁电镀材料 | 锡 |
| 行数 | 4 |
| 拾放盖 | 不带 |
| PC 板端接方法 | 通孔 |
| Contact Current Rating (Max) (A) | 1 |
| UL 易燃性等级 | UL 94V-0 |
| Connector System | 板对板 |
| 外形 | 标准 |
| 系列 | 系列 I |
| 高度 | 7.65 mm [ .300645 in ] |
| 端子接触部电镀材料 | 镀薄金 |
| 壳体颜色 | 黑色 |
| 板锁材料 | 黄铜 |
| 焊尾端子电镀厚度 | 3.81 µm [ 149.9997 µin ] |
| 端子布局 | 网络 |
| 工组温度范围 | -55 – 85 °C [ -67 – 185 °F ] |
| 产品类型 | 连接器 |
| 介质耐压 (VAC) | 750 |
| 电压 (VAC) | 250 |
| PCB 安装固定 | 带有 |
| PCB 安装对准 | 不带 |
| PCB 安装方向 | 直角 |
| 外壳材料 | LCP(液晶聚合物) |
| 端接柱体长度 | 3.1 mm [ .122 in ] |
| 焊尾端子电镀材料 | 锡 |
| 凸耳 | 不带 |
| 颜色 | 黑色 |
| 焊尾端子电镀材料表面涂层 | 哑光 |
| 密封底部 | 不带 |
| 外壳材料温度 | 高 |
| 封装数量 | 35 |
| 行间距 | 1.905 mm [ .0749 in ] |
| 连接器种类 | 母端 |
| 连接器和端子端接到 | 印刷电路板 |
| 尾部长度 | 3.1 mm [ .12183 in ] |
| 装配工艺特点 | 无 |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets | CHAMP Series I Appl Spec |
| Datasheets | 1734037 |
| Datasheets | RECEPTACLE ASSEMBLY, R/A, BTB, CHAMP050, SERIES I |
| Datasheets | 3D PDF |
| Datasheets | Connector, CHAMP, 050, Board-To-Board, Vertical and Right Angle Mounting |
| Datasheets | Connector, CHAMP, 050, Board-To-Board, Vertical and Right Angle Mounting |
| Datasheets | MD_1734037-5_020220151129_dmtec |
| QTY | UNIT PRICE | EXT PRICE |
|---|
| Company |
|
|---|---|
| Delivery | 3-5days |
| Costs | $75+ |
| Company |
|
|---|---|
| Delivery | 7-10days |
| Costs | $25+ |