STMicroelectronics
Image shown is a representation only. Exact specifications should be obtained from the product datasheet.
| Type | Description |
|---|---|
| Supplier Package | Flip-Chip |
| Standard Package Name | Flip-Chip |
| EU RoHS | Compliant |
| Maximum Operating Temperature | 85 |
| Typical Coupling | 37(Max) |
| Mounting | Surface Mount |
| Minimum Directivity | 20 |
| Module/IC Classification | IC |
| Packaging | Tape and Reel |
| Impedance | 50 |
| Maximum Insertion Loss | 0.2 |
| Package Width | 1.44 |
| Frequency Range | 0.824 to 2.17 |
| PCB | 8 |
| Package Length | 1.67 |
| Minimum Operating Temperature | -30 |
| Configuration | Bi-directional |
| Type | Directional |
| Pin Count | 8 |
| Lead Shape | Ball |
| Unit Pack | 5000 |
| MOQ | 5000 |
| Insertion Loss | 0.2dB |
| Coupling Factor | 37dB |
| Supplier Device Package | 8-FlipChip |
| Applications | W-CDMA |
| Coupler Type | Dual Band, Single Path |
| Standard Package | 5,000 |
| Frequency | 824MHz ~ 2.17GHz |
| Return Loss | 15dB |
| Other Names | 497-11305-2 |
| Package/Case | 8-UFBGA, FCBGA |
| rohs | Lead free / RoHS Compliant |
| Product | Directional Couplers |
| Operating Temperature Range | - 30 C to + 85 C |
| Termination Style | SMD/SMT |
| Frequency Range | 824 MHz to 2170 MHz |
| Impedance | 50 Ohms |
| Screening Level | Commercial |
| Rad Hardened | No |
| Package Type | CSP |
| Operating Temperature (Max) | 85C |
| Operating Temperature (Min) | -30C |
| DELETED | Compliant |
| 插入损耗 | 0.2dB |
| 回波损耗 | 15dB |
| 耦合系数 | 37dB |
| 频率 | 824MHz ~ 2.17GHz |
| 封装/外壳 | 8-UFBGA, FCBGA |
| 应用 | W-CDMA |
| 耦合器类型 | Dual Band, Single Path |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets | DCPL-WB-00D3 |
| QTY | UNIT PRICE | EXT PRICE |
|---|
| Company |
|
|---|---|
| Delivery | 3-5days |
| Costs | $75+ |
| Company |
|
|---|---|
| Delivery | 7-10days |
| Costs | $25+ |
Fedex,
UPS,
DHL
OnTrac,
LaserShip,
USPS,
Zippex,etc