GD32F103V8T6
GigaDevice · MCU
VerifiedFAE reviewed
| Parameter | STM32F103V8T6 | GD32F103V8T6 | Engineering note |
|---|---|---|---|
| Package and exact order code | STM32F103V8T6: LQFP100, 14 x 14 mm; -40 C to +85 C | GD32F103V8T6: LQFP100, Green Industrial; -40 C to +85 C | The exact order codes correspond in pin count, package family and temperature suffix. The reviewed datasheets show the same main-function sequence on pins 1 through 100. PCB land pattern and assembly release remain design responsibilities. |
| Memory and core clock | Arm Cortex-M3, 64 KB Flash, 20 KB SRAM, 72 MHz maximum | Arm Cortex-M3, 64 KB Flash, 20 KB SRAM, 108 MHz maximum | The documented memory capacities correspond and the target has more clock headroom. System clocks, bus dividers, Flash wait states and peripheral timing must be recalculated for the intended target frequency. |
| Operating supply voltage | 2.0 V to 3.6 V | 2.6 V to 3.6 V | The target minimum supply is 0.6 V higher. A board that can fall below 2.6 V is not covered by the target operating range without a separately validated design. |
| Pin functions and software | STM32F103 medium-density LQFP100 pin sequence, registers and STM32 firmware ecosystem | Pin-compatible GD32F103 medium-density LQFP100 sequence with different registers, clock tree, peripheral numbering and drivers | Pin-to-pin means physical main-function correspondence, not binary or source compatibility. Firmware migration, Flash latency, PLL settings and every used peripheral must be revalidated. |
FAE documentary review accepted for the exact ST STM32F103V8T6 and GigaDevice GD32F103V8T6 order codes. Both are 64 KB Flash, 20 KB SRAM Cortex-M3 LQFP100 devices rated -40 C to +85 C, with the same main-function sequence on pins 1 through 100. The target raises the minimum supply from 2.0 V to 2.6 V and the maximum core clock from 72 MHz to 108 MHz. Registers, clock configuration, peripheral numbering, firmware and tools differ; pin-to-pin does not mean direct firmware compatibility. Document review only; no bench, temperature-cycle, EMC, reliability or production qualification was performed.
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