Advanced Ceramic X Corporation- Fixed Inductors

Advanced Ceramic X Corporation (ACX) is a leading manufacturer of advanced ceramic-based RF and microwave passive components, founded in 1991 and headquartered in Hsinchu, Taiwan. The company focuses on the design and production of miniaturized, high-performance components for wireless connectivity applications. Its product portfolio includes chip antennas, LTCC (Low-Temperature Co-fired Ceramic) filters, diplexers, baluns, couplers, and ceramic substrates. Key product series such as the ACX chip antenna family and multilayer ceramic bandpass filters are widely used in IoT, automotive, consumer electronics, and industrial sectors. ACX’s components support standards like Wi-Fi, Bluetooth, GPS, and 5G, enabling reliable wireless communication. The company possesses strong in-house R&D capabilities in LTCC and thick-film technologies, allowing rapid customization for clients. As a trusted supplier to global OEMs and module makers, ACX has carved out a niche in the RF passive component market. It directly competes with major Japanese manufacturers through a combination of performance, cost efficiency, and flexible design services. With over three decades of industry experience, Advanced Ceramic X Corporation remains a key player in the evolving wireless infrastructure landscape.

Fixed Inductors - 型号列表

22 parts in total

Mfr Part #	Quantity Available	Price	Q @ Freq	Tolerance	Inductance	Current Rating (Max)	Resistance - Initial (Ri) (Min)	Height	Core Material	Package / Case	Type
HI1005-1C1N5SMT Ind RF Chip Multi-Layer 1.5nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 0402 T/R advanced ceramic x corp.	-		8@100MHz	0.3 nH	1.5 nH	300 mA	130 mOhm	0.6 mm	Ceramic	0402	RF Chip
HI1005-1C1N8SMT Ind RF Chip Multi-Layer 1.8nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 0402 T/R advanced ceramic x corp.	-		8@100MHz	0.3 nH	1.8 nH	300 mA	140 mOhm	0.6 mm	Ceramic	0402	RF Chip
HI1005-1C2N2SMT Ind RF Chip Multi-Layer 2.2nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 0402 T/R advanced ceramic x corp.	-		8@100MHz	0.3 nH	2.2 nH	300 mA	160 mOhm	0.6 mm	Ceramic	0402	RF Chip
HI1005-1C3N3SMT Ind RF Chip Multi-Layer 3.3nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 0402 T/R advanced ceramic x corp.	-		8@100MHz	0.3 nH	3.3 nH	300 mA	190 mOhm	0.6 mm	Ceramic	0402	RF Chip
HI1005-1C5N6SMT Ind RF Chip Multi-Layer 5.6nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 0402 T/R advanced ceramic x corp.	-		8@100MHz	0.3 nH	5.6 nH	300 mA	270 mOhm	0.6 mm	Ceramic	0402	RF Chip
HI1608-1C5N6SNT Ind High Frequency Chip Multi-Layer 5.6nH 0.3nH 100MHz 8Q-Factor Ceramic 600mA 0603 T/R advanced ceramic x corp.	-		8@100MHz	0.3 nH	5.6 nH	600 mA	300 mOhm	0.95 mm	Ceramic	0603	High Frequency Chip
HI1005-1CR10JMT Ind RF Chip Multi-Layer 100nH 5% 100MHz 8Q-Factor Ceramic 100mA 0402 T/R advanced ceramic x corp.	-		8@100MHz	5 %	100 nH	100 mA	2.5 Ohm	0.6 mm	Ceramic	0402	RF Chip
HI1005-1C15NJMT Ind RF Chip Multi-Layer 15nH 5% 100MHz 8Q-Factor Ceramic 250mA 0402 T/R advanced ceramic x corp.	-		8@100MHz	5 %	15 nH	250 mA	600 mOhm	0.6 mm	Ceramic	0402	RF Chip
HI0603-1C2N7SNT Ind High Frequency Chip Multi-Layer 2.7nH 0.3nH 100MHz 4Q-Factor Ceramic 300mA 0201 T/R advanced ceramic x corp.	10	15000: ¥0.0843	4@100MHz	0.3 nH	2.7 nH	300 mA	320 mOhm	0.33 mm	Ceramic	0201	High Frequency Chip
HI1005-1C2N7SMT Ind RF Chip Multi-Layer 2.7nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 0402 T/R advanced ceramic x corp.	-		8@100MHz	0.3 nH	2.7 nH	300 mA	170 mOhm	0.6 mm	Ceramic	0402	RF Chip
HI1005-1C10NJMT HH:130.00786.005 IND 0402 10NH J TOL Ind RF Chip Multi-Layer 10nH 5% 100MHz 8Q-Factor Ceramic 250mA 0402 T/R advanced ceramic x corp.	-		8@100MHz	5 %	10 nH	250 mA	450 mOhm	0.6 mm	Ceramic	0402	RF Chip
HI1005-1C1N2SMT Ind RF Chip Multi-Layer 1.2nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 0402 T/R advanced ceramic x corp.	-		8@100MHz	0.3 nH	1.2 nH	300 mA	120 mOhm	0.6 mm	Ceramic	0402	RF Chip
HI1005-1C6N8JMT Ind RF Chip Multi-Layer 6.8nH 5% 100MHz 8Q-Factor Ceramic 250mA 0402 T/R advanced ceramic x corp.	-		8@100MHz	5 %	6.8 nH	250 mA	320 mOhm	0.6 mm	Ceramic	0402	RF Chip
HI0603-1B4N7SHT HI0603-1B4N7SHT,4.7X0.3,300MA,0.35OHM Ind RF Chip Multi-Layer 4.7nH 0.3nH 100MHz 4Q-Factor Ceramic 300mA 0201 T/R advanced ceramic x corp.	-		4@100MHz	0.3 nH	4.7 nH	300 mA	500 mOhm	0.33 mm	Ceramic	0201	RF Chip
HI0603-1B15NJHT Ind RF Chip Multi-Layer 15nH 5% 100MHz 5Q-Factor Ceramic 250mA 0201 T/R advanced ceramic x corp.	-		5@100MHz	5 %	15 nH	250 mA	1.4 Ohm	0.33 mm	Ceramic	0201	RF Chip
HI1005-1C8N2JMT Ind RF Chip Multi-Layer 8.2nH 5% 100MHz 8Q-Factor Ceramic 250mA 0402 T/R advanced ceramic x corp.	-		8@100MHz	5 %	8.2 nH	250 mA	400 mOhm	0.6 mm	Ceramic	0402	RF Chip
HI1608-1C27NJNT Ind High Frequency Chip Multi-Layer 27nH 5% 100MHz 10Q-Factor Ceramic 600mA 0603 T/R advanced ceramic x corp.	-		10@100MHz	5 %	27 nH	600 mA	700 mOhm	0.95 mm	Ceramic	0603	High Frequency Chip
HI1005-1C3N9SMT Ind RF Chip Multi-Layer 3.9nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 0402 T/R advanced ceramic x corp.	-		8@100MHz	0.3 nH	3.9 nH	300 mA	220 mOhm	0.6 mm	Ceramic	0402	RF Chip
HI1005-1C4N7SMT Ind RF Chip Multi-Layer 4.7nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 0402 T/R advanced ceramic x corp.	-		8@100MHz	0.3 nH	4.7 nH	300 mA	240 mOhm	0.6 mm	Ceramic	0402	RF Chip
HI1005-1C1N0SMT Ind RF Chip Multi-Layer 1nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 0402 T/R advanced ceramic x corp.	-		8@100MHz	0.3 nH	1 nH	300 mA	120 mOhm	0.6 mm	Ceramic	0402	RF Chip

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Advanced Ceramic X Corporation- Fixed Inductors

Fixed Inductors - 型号列表

Resistance - Initial (Ri) (Min)

Inductance

Q @ Freq

Current Rating (Max)

Height

Package / Case

Tolerance

Type