The Bergquist Company, founded in 1964 and headquartered in Chanhassen, Minnesota, USA, is a global leader in the development and manufacture of thermal management materials. The company specializes in innovative heat dissipation solutions for electronic assemblies. Its core product lines include Sil-Pad® thermally conductive insulators, Gap Pad® gap filling materials, Hi-Flow® phase change materials, Softface® thermal interface materials, and Bond-Ply® thermally conductive tapes. Bergquist also produces Thermal Clad® Insulated Metal Substrate (IMS) technology, featuring high-performance dielectric layers on aluminum or copper baseplates for high-power surface-mount applications. These substrates are critical in power electronics, LED lighting, automotive, and telecommunications. In 2014, Bergquist was acquired by Henkel AG & Co. KGaA, integrating into its Adhesive Technologies unit and enhancing Henkel’s electronics assembly portfolio. With decades of engineering expertise, Bergquist products are recognized worldwide for reliability and performance. The company’s innovations have set industry benchmarks in thermal management, enabling efficient cooling in increasingly dense electronic devices. Today, the Bergquist brand maintains market leadership through Henkel’s global manufacturing and distribution reach.