Deca Technologies, Inc. is a U.S.-based provider of advanced electronic interconnect solutions. Founded in 2011 as a subsidiary of Cypress Semiconductor, the company is now an independent entity headquartered in Tempe, Arizona. Deca specializes in wafer-level and panel-level packaging technologies for semiconductors. Its flagship products include the M-Series fan-in wafer-level chip scale packaging (WLCSP) and the P-Series panel-level packaging with Adaptive Patterning™ technology. The M-Series offers high-density, low-cost packaging for various chips such as power management ICs and RF devices. The P-Series enables large-area panel processing for multi-die integration, significantly improving cost efficiency and performance. Deca’s innovative approach addresses the growing demand for miniaturization and heterogeneous integration in electronics. The company is recognized as a pioneer in panel-level packaging, a field expected to revolutionize semiconductor assembly. With strong partnerships across the industry, Deca supports automotive, mobile, and IoT applications. Its technology has been adopted by major semiconductor companies, underscoring its competitive edge in the advanced packaging market.