JSP Corporation, formerly known as Japan Special Plastics Co., Ltd., is headquartered in Tokyo, Japan. Founded in 1962, the company initially focused on expanded polystyrene (EPS) and later diversified into functional plastics. In the electronics sector, JSP manufactures high-precision plastic components and packaging solutions for semiconductor and electronic components, such as carrier tapes, trays, and reels. Their product lines include EPS, polypropylene foam, and expanded polypropylene (EPP) used for electronic device protection and thermal insulation. JSP is a leading supplier of integrated plastic packaging systems to the global electronics manufacturing industry, serving major OEMs and component makers. The company has a strong R&D focus on lightweight, recyclable materials that meet stringent ESD (electrostatic discharge) requirements. With manufacturing sites in Japan, Asia, and the Americas, JSP ensures reliable supply chain and technical support. As a pioneer in foaming technology, JSP holds significant patents in polymer foam processes, giving it a competitive edge in performance and cost-effectiveness. The company is publicly traded on the Tokyo Stock Exchange under ticker 7942, and its commitment to sustainability makes it a key partner for advanced material solutions.