Qualcomm Incorporated- Solid State Relays

Qualcomm Incorporated is an American multinational corporation headquartered in San Diego, California, founded in 1985 by Irwin Jacobs and Andrew Viterbi. The company is a global leader in semiconductor products and wireless telecommunications technologies. Its core business areas include mobile processors (Snapdragon platform), modems, radio frequency (RF) front-end solutions, and automotive connectivity solutions. The product series notably feature the Snapdragon family of application processors and system-on-chips (SoCs) for smartphones, tablets, and automotive infotainment. Other key products include the X-series modems (e.g., Snapdragon X70) and FastConnect connectivity systems for Wi-Fi and Bluetooth. In the RF front-end market, Qualcomm provides complete modem-to-antenna solutions. The company also ventures into automotive with the Snapdragon Digital Chassis platform. Qualcomm holds a dominant position in the mobile chipset market, powering a majority of high-end Android smartphones, and is a key enabler of 5G technology deployment worldwide. It consistently ranks among top fabless semiconductor companies and is a powerhouse in cellular technology intellectual property.

Solid State Relays - 型号列表

1 parts in total

Mfr Part #	Quantity Available	Price	Standard Package	Rad Hardened	Coil Power	Inductance	Coil Current	Coil Voltage	Release Time	Power - Rated	Visible Output	Voltage - Test	Coil Resistance	Voltage - Supply	Switching Voltage	Switching Capacity	Voltage - Rated AC	Current - Switching	Diode Configuration	Current Rating (Max)	Current - Max/Contact	Voltage - Input (Min)	Contact Rating (Current)	High Side Voltage - Max (Bootstrap)	Voltage - Protection Level (VP) (2416)	AC contacts rating (at resistance load)	DC contacts rating (at resistance load)	Seal	Size	Depth	Pitch	Height	Weight	Packaging	Size - Body	Contact Form	Pitch - Post	Mounting Type	Mounting Style	Package / Case	Contact Material	Length - Overall	Size / Dimension	Termination Style	Number of Contacts	Number of Positions	Contact Layout, Typical	Type	Relay Type	Manufacturer	Push-to-Test	Relay Variant	Number of Units	Output Configuration	Contacts Configuration	Operate Time	Mechanical Life	Ingress Protection	Operating Temperature
5-1393234-1 Electromechanical Relay DPDT 14A 24VDC 1.1KOhm Through Hole Electromechanical Relay DPDT 14A 24VDC 1.1KOhm Through Hole Product Highlights:RPII/2 SeriesContact Arrangement = 2 Form C, DPDT, 2 C/OContact Current Rating = 8 Amps.Monostable Coil Magnetic SystemWithout Coil Suppression Diode Relay: electromagnetic; DPDT; Ucoil:24VDC; 8A/250VAC; 8A/24VDC PCB power relay 24 VDC 500 mW, 5-1393234-1, TE Connectivity Qualcomm Incorporated	-		Bulk	No	500mW	1100	21.8 mA	24V	2ms	2KVA	No	4	1.1 KOhm	24 V	max 440V AC, max 300V DC	4kVA	400V	8 A	No	14 A	8A	400 V	14 A	16.8VDC	IP 42	8 A / 250 VAC	8 A / 24 VDC	Flux	29 x 12.6 x 25.5 mm	12.6 mm	5	25.5 mm	0.02 kg	Tube	29 x 12.6 x 25.5mm	2 Form C	5mm	Through Hole	Through Hole	Dust Cover	Silver Cadmium Oxide	29 mm	see	PC Pin	2 change-over (CO)	8	DPDT	Power Relay	Non-Latching	RP420024	No	miniature	1	see	DPDT	9 ms	30000000cycles	IP40	-40 to 70 °C

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