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TE Connectivity Ltd.

TE Connectivity Ltd.- Ceramic Capacitors

TE Connectivity Ltd. is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Originally part of Tyco International, the company was spun off as Tyco Electronics in 2007 and rebranded to TE Connectivity in 2011. Headquartered in Schaffhausen, Switzerland, with its operational headquarters in the United States, TE Connectivity designs and manufactures over 500,000 products that connect and protect the flow of power and data. The company's product portfolio includes connectors, sensors, relays, antennas, heat shrink tubing, and cable assemblies under well-known brands such as AMP, DEUTSCH, and Raychem. TE serves diverse markets including automotive, industrial equipment, data communications, aerospace, defense, medical, and energy. Its connector and sensor solutions are critical in applications ranging from electric vehicles and autonomous driving to cloud computing and smart factories. TE Connectivity is a publicly traded company listed on the New York Stock Exchange under the ticker symbol TEL. With approximately 90,000 employees worldwide, the company generates annual sales of about $13.3 billion. In China, TE entered in 1989 and now employs around 38,000 people across 16 manufacturing sites and 14 sales offices, with its Chinese entity Tyco Electronics (Shanghai) Co., Ltd. managing operations. As a market leader, TE holds one of the top positions in the global connector and sensor markets, consistently innovating with smarter, faster, and better technologies to empower its customers.

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Ceramic Capacitors - 型号列表

258 parts in total

Number of Contacts

Factory Pack Quantity

Operating Temperature

Number of Positions

Number of Positions or Pins (Grid)

Depth

Row Spacing

Housing Material

Length - Overall

Connector Type

Contact Finish

Type

Series

Standard Package

RoHS

Packaging

Mounting Style

Gender

Features

Product Category

Height

Mounting Type

Termination Style

Package Quantity

Termination Post Length

Contact Finish Thickness

For Use With/Related Products

Contact Resistance

Insulation Resistance

Pitch

Length

Number of Pins

Number of Rows

Contact Material

Other Names

Material Flammability Rating

Plating

Manufacturer

Tariff No

Lead Time

Material

Product

Width

Base Type

Termination

Contact Type

Size / Dimension

RoHSELV Compliance

Switch Function

Current Rating (Max)

Color

Body Color

Lead Style

Plating - Body

Connector Style

Profile (W x H)

Panel Mount Type

Compatible Shell Size

Contact Length - Post

Contact Layout, Typical

Stackable

Product Type

Weight

Operating Temperature - Junction

Temperature

Shell Style

Pitch - Post

Mfr Part #Quantity AvailablePriceStandard PackageRoHSTerminationContact FinishTypeFeaturesMounting TypeNumber of RowsPitchGenderNumber of ContactsNumber of PositionsMounting StyleContact MaterialHousing MaterialProduct CategoryFactory Pack QuantityPackagingOperating TemperatureHeightLength - OverallContact Finish ThicknessMaterial Flammability RatingDepthNumber of Positions or Pins (Grid)ProductTermination StyleConnector TypeManufacturerRad HardenedContact ResistanceInsulation ResistanceRow SpacingInsulation MaterialSeriesRoHSELV ComplianceColorConnector StyleProfile (W x H)Termination Post LengthProduct TypeFor Use With/Related ProductsLeadfree DefinSwitch FunctionTemperature RatingCurrent Rating (Max)Package QuantityContact TypeMaterial - TipPlating - BodyNumber of PortsLengthBase TypeNumber of PinsDELETEDMain PurposeOutput ConfigurationOther NamesPlatingBody ColorPolarizationInsert MaterialMounting FeaturePanel Mount TypeTariff NoVoltage - Supply (Min)WeightOperating Temperature - JunctionLead TimeSubcategoryMaterialWidthSize / DimensionVoltage - Rated ACLead StyleCompatible Shell SizeContact Length - PostContact Layout, TypicalStackableContact TerminationTemperatureShell StylePitch - PostHeight (Inches)NoteProprietary NameOther SpecificationsTemperature RangeResistance - InputVoltage - ClampingActuator TypeBushing, Grommet TypeAssembly ConfigurationThermal Resistance of Package1st Connector Mounting TypeSealedShaft SizeSurface Mount Land SizeMechanical LifeIndustry AliasesPart # AliasesProtectionPart StatusDiameterStud/Tab SizeInsulation ColorPrimary MaterialDiameter - InsideColor - ConnectorsDiameter - OutsideMaximum Cable LengthMaterial - InsulationLength - Protective TubeMaximum Temperature LimitLength - PinPackage / CaseStandard PackFootprintLock TypeSize - BodyShell FinishHousing ColorPin or SocketShell PlatingFlange FeatureShell MaterialLocking FeaturePanel ThicknessCenter Contact PlatingCenter Contact MaterialContact Finish - MatingBackshell Material, PlatingStacking MethodTermination Rows1st Connector Type
2-641260-1
3
2-641260-1

Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN IC SOCKET 8POS DIP TIN IC Socket DIP8 2.54mm Diplomate IC & Component Sockets DIP-8 W/RET TAILS Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 8Row-to-Row Spacing = 7.87 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, Socket,DIP;8Pins;DualLeaf;Open;SolderTail;0.31In.;BerylliumCopper;Tin

te connectivity / amp

121: ¥102.00BulkLead free / RoHS CompliantSolderTinDIP SocketClosed FrameThrough Hole22.54 mmSKT8Not RequiredPCBBeryllium CopperThermoplasticIC & Component Sockets52Tube+105°C5.33 mm10.03 mm--10.01mm8 (2 x 4)DIP / SIP SocketsThrough Hole--No30 mohm10000 Mohm7.62mmThermoplasticDiplomate DL, AMP------------Stamped---10.03mmDIP8 (2 x 4)CompliantClosed FrameThrough Hole--------------5.33mm10.03 x 5.33 x 10.01mm--------------------------------------------------------------
2-641615-1
4
2-641615-1

Conn DIP Socket SKT 28 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN SOCKET VERT 28 POS TIN DIP Diplomate DIP Socket 2.54x15.49mm 28P Socket; DIP;Dual Leaf;28 Pos.;0.100In.cen.;Thru Hole;0.610In.;Ber. Copper;Tin;0. IC & Component Sockets 28C DL SOCKET Conn DIP Socket SKT 28 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 28Row-to-Row Spacing = 15.49 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, Socket,DIP;DualLeaf;28Pos.;0.100In.cen.;ThruHole;0.610In.;Ber.Copper;Tin;0.

te connectivity / amp

37761: ¥6.12BulkLead free / RoHS CompliantSolderTinDIP SocketClosed FrameThrough Hole22.54 mmSKT28Not RequiredThrough HoleBeryllium CopperGlass Fibre Reinforced ThermoplasticIC & Component Sockets1500Tube+105°C5.33 mm35.43 mm-UL 94 V-017.63 mm28 (2 x 14)DIP / SIP Sockets---No30 mohm10000 Mohm15.49mmThermoplastic-------------Stamped------Compliant--26416151-----------------------------------------------------------------------------
1734100-5
3
1734100-5

Conn SCSI PL 50 POS 2.54mm Solder ST Thru-Hole 50 Terminal 1 Port 1.27 [.050] Series I, HD, FH and J Connectors CONN PLUG 50POS VERT .050 T/H Board to Board & Mezzanine Connectors 050 SER I 50P PLUG ASSY Conn SCSI PL 50 POS 2.54mm Solder ST Thru-Hole 50 Terminal 1 Port Product Highlights:ConnectorApplies To Printed Circuit BoardHousing Gender = Plug50 Positions1.27 mm Centerline Champ050 series,50pos,Au over PdNi

te connectivity / amp

161: ¥33.4282BulkLead free / RoHS CompliantSolderTinSCSIBoard LockThrough Hole22.54 mmPL5050Thru HolePhosphor BronzeLiquid Crystal Polymer (LCP)Board to Board & Mezzanine Connectors1296-55 – 105 °C [ -67 – 221 °F ]10 mm1.27 [0.050]FlashUL 94V-07.1 mm--Through HoleSeries IAMP-----系列 IRoHS compliant, ELV compliantBlackCenter Strip ContactsStandard2.54 [0.100]ConnectorBoard To Board ApplicationsWave solder capable to 240°C, Wave solder capable to 260°C, Wave solder cWithStandard154-BrassTin-Copper over Nickel1 Port-------哑光黑色Keying Post磷青铜板锁通孔---------250正方形母端组件2.54 mm [ .099822 in ]网络---------1000750带有不带.8 – 1.6 mm [ .031 – .063 in ]-----------------------------------------
1-1734100-0
7
1-1734100-0

Conn SCSI PL 100 POS 2.54mm Solder ST Thru-Hole 100 Terminal 1 Port 1.27 [.050] Series I, HD, FH and J Connectors PLUG ASSY,CHAMP 050,SER I,100P I/O Connectors VERT PLUG 100P Series I w/locks Conn SCSI PL 100 POS 2.54mm Solder ST Thru-Hole 100 Terminal 1 Port Product Highlights:ConnectorPlugNumber of Positions = 1001.27 mm CenterlineStandard Profile BOARD-BOARD CONNECTOR PLUG, 100WAY, 2ROW Champ050 series,100pos,Au over PdNi

te connectivity / amp

15431: ¥41.956Rail / TubeLead free / RoHS CompliantSolderTinSCSIBoard LockThrough Hole22.54 mmPL100100Thru HolePhosphor BronzeLiquid Crystal Polymer (LCP)I/O Connectors864--55C to 85C10 mm1.27 [0.050]FlashUL 94V-07.1 mm--Solder TailSeries IAMP-----:Champ 0.050RoHS compliant, ELV compliantBlackCenter Strip ContactsStandard2.54 [0.100]ConnectorBoard To Board ApplicationsWave solder capable to 240°C, Wave solder capable to 260°C, Wave solder cWithStandard1/Contact A--BrassTin-Copper over Nickel1 Port------A33459--Keying Post---85366930250VAC085C-----------:Through Hole Vertical--------------:PCB----------------------------------------
2-382462-3
2-382462-3

Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN SOCKET DIP 8POS VERT T/H IC & Component Sockets 8P DIP HI TEMP PHBZ 8P DIP HI TEMP PHBZ 2-382462-3 Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 8Row-to-Row Spacing = 7.87 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package,

te connectivity / amp

16271: ¥2.584Rail / TubeLead free / RoHS CompliantSolderTinDIP SocketClosed FrameThrough Hole22.54 mmSKT8-Through HolePhosphor BronzePolyesterIC & Component Sockets52Tube+ 105 C-----8 (2 x 4)DIP / SIP SocketsSolder-----7.87 mm------------------------------------------------------------------------------------------------------
5175475-3
3
5175475-3

CONN SCSI F 30 POS 1.27MM SLDR ST TH 30TERM Board to Board & Mezzanine Connectors .050CL CHAMP VERT RC 1.27 [.050] Series I, HD, FH and J Connectors CONN CHAMP RCPT 30POS .050 VERT CHAMP 050 BTB REC V 30P W/LEG

te connectivity / amp

105000: ¥26.60845,400RoHS CompliantSolderGold (8)Board to Board, High DensityBoard LockVertical21.27 mm [ .05 in ]Receptacle-30Thru HolePhosphor BronzeNylon--Tray-55 – 85 °C [ -67 – 185 °F ]7 mm [ .275 in ]1.27 [0.050]8µin (0.20µm)UL 94V-0---插座High Density (HD)AMP-----Series IRoHS compliant, ELV compliantBlackOuter Shroud ContactsStandard3.10 [0.122]ConnectorBoard To Board ApplicationsWave solder capable to 240°C, Wave solder capable to 260°C, Wave solder cWithoutStandard1150-BrassTin over Nickel---------黑色-磷青铜板锁通孔---------250直角插头组件3.1 mm [ .123 in ]同轴No-Standard--------------Without不带WithoutObsolete------------------------------------
643642-2
643642-2

Conn SIP Socket SKT 10 POS 2.54mm Solder ST Thru-Hole Tray CONN SOCKET SIP 10POS .100 GOLD

te connectivity / amp

-BulkContains lead / RoHS non-compliantSolderGoldSIP SocketClosed FrameThrough Hole12.54 mmSKT10----------30µin (0.76µm)--10 (1 x 10)--------------------------------------------------------------------------------------------------------------
382437-3
382437-3

Conn SIP Socket SKT 3 POS 2.54mm Solder ST Thru-Hole Tray SIP Sockets CONN SOCKETS SIP 3POS TIN IC & Component Sockets 3P SIP SOCKET Conn SIP Socket Strip SKT 3 POS 2.54mm Solder ST Thru-Hole Tray Conn SIP Socket Strip SKT 3 POS 2.54mm Solder ST Thru-Hole Tray Product Highlights:Number of Positions = 3Contact Style = Stamped + FormedLeg Style = StandardPhosphor Bronze Contact Base MaterialTin Contact Mating Area Plating MaterialSearch Keywords:single in-line IC package, NIC, Network Interface Cards, PC Cards, IC sockets, pc board mount, hybrid, EIA RS-415, MIL-S-83734, Table 23.1, UL 1410,

te connectivity / amp

102960: ¥3.4462BulkContains lead / RoHS non-compliantSolderTin-LeadSIP SocketClosed FrameThrough Hole12.54 mmSKT3Not RequiredThrough HolePhosphor BronzeThermoplasticIC & Component Sockets2960Tray-55C to 105C5.33 mm7.49 mm--3.91 mm3 (1 x 3)DIP / SIP Sockets---No20 mohm5000 Mohm-ThermoplasticDiplomate DL, AMP------------------3 (1 x 3)-Closed FrameThrough Hole------------------------------------------------------------------------------
2-640357-4
4
2-640357-4

Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN IC SOCKET 14POS DIP 15AU IC & Component Sockets 14 CLOSED FRAME GOLD Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 14Row-to-Row Spacing = 7.87 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, SEE374-45521825093-3

te connectivity / amp

821200: ¥3.604Rail / TubeContains lead / RoHS non-compliantSolderGoldDIP SocketClosed FrameThrough Hole22.54 mmSKT14Not RequiredThrough HolePhosphor BronzeThermoplasticIC & Component Sockets30Tube-55C to 125C5.33 mm17.65 mm15µin (0.38µm)UL 94 V-010.01 mm14 (2 x 7)DIP / SIP Sockets---No30 mohm10000 Mohm7.62 mmThermoplasticDiplomate DL, AMP------------------14 (2 x 7)-Closed FrameThrough Hole------------------------------------------------------------------------------
5-175472-8
5-175472-8

CONN SCSI PL 68 POS 2.54MM SLDR RA TH 68TERM .050CL,CHAMP,R/TANG PLUG,68POS

te connectivity / amp

10800: ¥63.05580Contains lead / RoHS non-compliantSolderGoldBoard to BoardBoard LockThrough Hole, Right Angle2---68---------30µin (0.76µm)-----Plug---------Center Strip Contacts---5-5175472-8--------------------------56 DaysConnector SCSI-----------------------------5175472-8-----------------------------------
S01-02-R
8
S01-02-R

Cable Accessories Terminator Solder & Shield Tubing .105 O/D .055 S/D Shield Terminators SOLDER SLEEVE IMMERS RESIS .650" Sleeve,Solder,ImmersionResistant,Transp Cable Accessories Shield Terminator Thermoplastic Blue Tin/Silver TERMINAL, SLEEVE, 2.65MM, BLUE SolderSleeve;ShieldTerminator;TransBlue;Polyvinylidene;16.5mmL;S01M83519Series

te connectivity / raychem wire

100841: ¥13.328BulkNo:Solder:TinWire to WireImmersion Resistant-------:--Solder & Shield Tubing100Bulk----No----:Solder SleeveS01M83519Series-----S01-Blue, Transparent--------------0.650" (16.51mm)------------85369010-0.002---PVDF---------+ 125 C-------------------642145-000Sleeve,Solder642145-0000.105" (2.6mm), 0.145" (3.7mm):-:BlueSolderSleeve0.105"Blue2.65(0.105)mm(In.)2.65mm:PVDF (Polyvinylidene Fluoride)16.5mm+ 150 C---------------------
2-557103-5
2-557103-5

I/O Connectors VERT RECPT 100P Series I w/locks RCPT ASSY,CHAMP 050,SER I,100P

TE Connectivity / AMP

-864Lead free / RoHS non-compliantSolderGoldBoard to BoardBoard Guide, Board LockThrough Hole2---100---------30µin (0.76µm)-----Receptacle---------Outer Shroud Contacts---1-1734101-0--------------------------137 DaysConnector SCSI-----------------------------------------------------------------
1825093-1
8
1825093-1

Conn DIP Socket SKT 6 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN IC SOCKET 6 POS DIP 15AU Dip socket 6 way 2.54mm Diplomate Socket; DIP;Dual Leaf;6 Pos.;0.100In.cen.;Thru Hole;0.310In.;Phosphor Bronze IC & Component Sockets 6P CLOSED FRAME GOLD Conn DIP Socket SKT 6 POS 2.54mm Solder ST Thru-Hole Tube Search Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, DIP SOCKET, 6POS, THROUGH HOLE Socket,DIP;DualLeaf;6Pos.;0.100In.cen.;ThruHole;0.310In.;PhosphorBronze

te connectivity / amp

20001: ¥2.6996Rail / TubeLead free / RoHS CompliantSolderTinDIP SocketClosed FrameThrough Hole22.54 mmSKT66VerticalPhosphor BronzeThermoplastic Glass ReinforcedIC & Component Sockets70Tube+125°C5.33 mm2.54 [0.100]15µin (0.38µm)UL 94V-00.21in6 (2 x 3)DIP / SIP SocketsSolder Tail:DIP SocketTyco ElectronicsNo3010,0000.3inThermoplastic:DIPLOMATE DLRoHS compliant, ELV compliantBlack-Standard3.25 [0.128]DIP Socket-Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c---TubeDual Leaf---0.295inClosed Frame-----------85366910-0.002----0.394in0.295 x 0.394 x 0.21in------:Through Hole Vertical-Closed7.62 [0.300]5.33 [0.210]ONLY sockets with straight solder tails are recommended for automatic insertionDIPLOMATE DLStraight125--------------------------:0.125"DIP-------------------
643651-3
643651-3

Conn SIP Socket SKT 19 POS 2.54mm Solder ST Thru-Hole Tray CONN SOCKET SIP 19POS .100 TIN

te connectivity / amp

-BulkLead free / RoHS CompliantSolderTinSIP SocketClosed FrameThrough Hole12.54 mmSKT19-------------19 (1 x 19)--------------------------------------------------------------------------------------------------------------
787882-1
2
787882-1

Conn Board to Board F 200 POS 1.27mm Solder RA Thru-Hole 1.27 [.050] Series I, HD, FH and J Connectors 200 50SR CMP LP R/A RCPT DOCK I/O Connectors 200 50SR CMP LP R/A RCPT DOCK

te connectivity / amp

10168: ¥285.8706BulkContains lead / RoHS non-compliantSolderGold Over NickelBoard to BoardBoard LockRight Angle41.27 mmF200 POS200Thru Hole (SMT Compatible)-Liquid Crystal Polymer (LCP)-----30µin (0.76µm)UL 94V-0---插座BlindmateAMP------Not ELV/RoHS compliant-Outer Shroud ContactsLow2.49 [0.098]Connector5787882-1-WithoutStandard-24-----------Tin-Lead over Nickel自然-磷青铜板锁With----80 DaysConnector SCSIStainless Steel---------------------------------------------248-Row [8-Row]With.81 – 1.2 mm [ .032 – .047 in ]铜镀镍NaturalNickel over CopperNickel over CopperMating Side; Female ScrewlockSteelWithout0.81 – 1.20 [0.032 – 0.047]With1.27 [0.050]铜打底镀镍镍打底镀锡铅---
1734099-8
5
1734099-8

Conn SCSI PL 80 POS 2.54mm Solder RA Thru-Hole 80 Terminal 1 Port 1.27 [.050] Series I, HD, FH and J Connectors CONN PLUG 80POS .050" RT ANG I/O Connectors R.A. PLUG 80P Series I HI-TEMP Conn SCSI PL 80 POS 2.54mm Solder RA Thru-Hole 80 Terminal 1 Port Product Highlights:ConnectorPlugNumber of Positions = 801.27 mm CenterlineStandard Profile Champ 050 series,plug assembly

te connectivity / amp

101: ¥64.778BulkLead free / RoHS CompliantSolderTinSCSIBoard LockThrough Hole22.54 mmPL8080Thru HolePhosphor BronzeLiquid Crystal Polymer (LCP)I/O Connectors21--55C to 105C7.5 mm1.27 [0.050]FlashUL 94V-017.46 mm-SCSI ConnectorsSolder TailSeries IAMP------RoHS compliant, ELV compliantBlackCenter Strip ContactsStandard3.10 [0.122]ConnectorBoard To Board ApplicationsWave solder capable to 240°C, Wave solder capable to 260°C, Wave solder cWithoutStandard1/Contact A----1 Port-------Tin-Copper over Nickel------250VAC-105C--Brass-------------------------------------------------------------13.20 [0.520]--
1825109-3
6
1825109-3

Conn DIP Socket SKT 40 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN IC SOCKET 40POS DIP 15AU IC & Component Sockets 40P ECONOMY GOLD Conn DIP Socket SKT 40 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 40Row-to-Row Spacing = 15.49 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, Socket,DIP;DualLeaf;40Pos.;0.100In.cen.;ThruHole;0.610In.;PhosphorBronze TE Connectivity 2.54mm 节距 40 路, 通孔 标准引脚 DIL 插座

te connectivity / amp

101: ¥14.348Rail / TubeLead free / RoHS CompliantSolderTinDIP SocketOpen FrameThrough Hole22.54 mmSKT4040VerticalPhosphor BronzeThermoplastic Glass ReinforcedIC & Component Sockets10Tube+125°C5.33 mm2.54 [0.100]15µin (0.38µm)UL 94V-0-40 (2 x 20)DIP / SIP SocketsThrough Hole-Tyco ElectronicsNo3010,00015.49 mmThermoplastic-RoHS compliant, ELV compliantBlack-Standard3.25 [0.128]DIP Socket-Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c---TubeDual Leaf----DIP----------------------------Ladder15.49 [0.610]5.33 [0.210]ONLY sockets with straight solder tails are recommended for automatic insertionDIPLOMATE DLStraight125---------------------------------------------焊接标准引脚
2-640379-4
3
2-640379-4

Conn DIP Socket SKT 40 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN IC SOCKET 40POS DIP 15AU IC & Component Sockets 40 CLOSED FRAME GOLD Conn DIP Socket SKT 40 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 40Row-to-Row Spacing = 15.49 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, DIP.600CLDLPHBR/AU,40CDIPLOMATESOK15AUPHBZ

te connectivity / amp

2564: ¥9.18Rail / TubeContains lead / RoHS non-compliantSolderGoldDIP SocketClosed FrameThrough Hole22.54 mmSKT40Not RequiredThrough HolePhosphor BronzeThermoplasticIC & Component Sockets10Tube+ 125 C5.33 mm50.67 mm15µin (0.38µm)-17.63 mm40 (2 x 20)DIP / SIP SocketsSolder--No30 mohm10000 Mohm15.24 mmThermoplastic-----------------------------------------------------------------------------------------------------
1734101-4
3
1734101-4

Conn SCSI RCP 40 POS 2.54mm Solder ST Thru-Hole 40 Terminal 1 Port 1.27 [.050] Series I, HD, FH and J Connectors CONN RCPT 40POS VERT .050 T/H Board to Board & Mezzanine Connectors 050 series 40p 30 Au Conn SCSI RCP 40 POS 2.54mm Solder ST Thru-Hole 40 Terminal 1 Port Product Highlights:ConnectorApplies To Printed Circuit BoardHousing Gender = Receptacle40 Positions1.27 mm Centerline Champ050 series,40pos,Au over PdNi

te connectivity / amp

224100: ¥17.272Rail / TubeLead free / RoHS CompliantSolderTinSCSIBoard Guide, Board LockThrough Hole22.54 mmRCP4040Thru HolePhosphor BronzePPABoard to Board & Mezzanine Connectors1296Tube-55C to 85C10 mm1.27 [0.050]FlashUL 94V-07.1 mm---Series IAMP------RoHS compliant, ELV compliantBlackOuter Shroud ContactsStandard2.54 [0.100]ConnectorBoard To Board ApplicationsWave solder capable to 240°C, Wave solder capable to 260°C, Wave solder cWithStandard1/Contact A--BrassTin-Copper over Nickel1 Port------17341014--Keying Post----250VAC-85C-------------------------------------------------------------------
2-641609-1
3
2-641609-1

Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN IC SOCKET 14POS DIP TIN Socket; DIP;Dual Leaf;14 Pos.;0.100In.cen.;Thru Hole;0.310In.;Ber. Copper;Tin IC & Component Sockets 14C DIPLOMATE SOK Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 14Row-to-Row Spacing = 7.87 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, Socket,DIP;DualLeaf;14Pos.;0.100In.cen.;ThruHole;0.310In.;Ber.Copper;Tin

te connectivity / amp

13151: ¥5.304BulkLead free / RoHS CompliantSolderTinDIP SocketClosed FrameThrough Hole22.54 mmSKT14Not RequiredThrough HoleBeryllium CopperThermoplasticIC & Component Sockets3000Tube- 55 C to + 125 C5.33 mm17.65 mm-UL 94 V-010.01 mm14 (2 x 7)DIP / SIP Sockets---No30 mohm10000 Mohm7.62 mmThermoplastic--------------------Compliant--------------------------------------------------------------------------------
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