The 2011-2X40G interconnect series from Oupiin America Inc. is a robust line of 80-position 2.54mm through-hole headers designed for high-density interconnect applications. These headers are commonly used in data center switch modules, server backplanes, and other high-performance networking equipment where reliability and density are crucial.

If you're working on building or upgrading a high-speed interconnect solution, these headers offer a reliable and flexible option. They support up to 40Gbps per lane, making them suitable for 100Gbps and 200Gbps network interfaces. One thing worth noting is their excellent signal integrity; they are designed to minimize crosstalk and ensure stable data transmission over long distances.

Engineers tend to reach for this when they need a high-density interconnect that can handle high data rates without compromising on performance. The 2.54mm pitch is a standard choice in many industry-standard connectors, which makes these headers easy to work with and compatible with a wide range of PCB designs. Additionally, the 80-position count provides a lot of flexibility in how you can route your signals, making them ideal for complex board layouts.