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BNSCE201210 inductor surface mount Series
Multi - layer chip inductors for various applications
The BNSCE201210 inductor series from Bourns is a lineup of multi-layer chip inductors designed for a wide range of surface-mount applications. These components are commonly used in power supplies, switching regulators, and RF circuits due to their compact size and high-frequency performance. If you're working on projects that require small footprint inductors with good DC resistance and inductance stability, these are a solid choice.
One thing worth noting is that engineers tend to reach for this series when they need inductors that can handle higher currents without significant size increase. The multi-layer construction allows for better magnetic field containment, which is crucial in dense PCB layouts. Additionally, these inductors are known for their excellent temperature coefficient, making them reliable even under varying operating conditions. If you're facing issues with EMI in your designs, these inductors can help mitigate those problems by providing a low-profile solution with good shielding properties.
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BNSCE201210 inductor surface mount - Part List
13 parts in total| Mfr Part # | Quantity Available | Price | Category | Q @ Freq | Tolerance | Inductance | Current Rating (Max) | Resistance - Initial (Ri) (Min) | Height | Core Material | Package / Case | Type | Depth |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 0 | - | 21(Typ)@100MHz | 5 % | 12 nH | 300 mA | 350 mOhm | 1.03 mm | Ceramic | 0805 | Chip | 1.45 mm | ||
| 0 | - | 23(Typ)@100MHz | 5 % | 47 nH | 300 mA | 700 mOhm | 1.03 mm | Ceramic | 0805 | Chip | 1.45 mm | ||
| 0 | - | 23(Typ)@100MHz | 5 % | 27 nH | 300 mA | 550 mOhm | 1.03 mm | Ceramic | 0805 | Chip | 1.45 mm | ||
| 0 | - | 24(Typ)@100MHz | 5 % | 82 nH | 300 mA | 900 mOhm | 1.03 mm | Ceramic | 0805 | Chip | 1.45 mm | ||
| 0 | - | 18(Typ)@100MHz | 5 % | 4.7 nH | 300 mA | 200 mOhm | 1.03 mm | Ceramic | 0805 | Chip | 1.45 mm | ||
| 0 | - | 17(Typ)@100MHz | 5 % | 470 nH | 300 mA | 1.5 Ohm | 1.45 mm | Ceramic | 0805 | Chip | - | ||
| 0 | - | 23(Typ)@100MHz | 5 % | 22 nH | 300 mA | 500 mOhm | 1.03 mm | Ceramic | 0805 | Chip | 1.45 mm | ||
| 0 | - | 23(Typ)@100MHz | 5 % | 100 nH | 300 mA | 900 mOhm | 1.2 mm | Ceramic | 0805 | Chip | 1.45 mm | ||
| 0 | - | 22(Typ)@100MHz | 5 % | 150 nH | 300 mA | 1 Ohm | 1.2 mm | Ceramic | 0805 | Chip | 1.45 mm | ||
| 0 | - | 24(Typ)@100MHz | 5 % | 33 nH | 300 mA | 600 mOhm | 1.03 mm | Ceramic | 0805 | Chip | 1.45 mm | ||
| 0 | - | 22(Typ)@100MHz | 5 % | 15 nH | 300 mA | 400 mOhm | 1.03 mm | Ceramic | 0805 | Chip | 1.45 mm | ||
| 0 | - | 25(Typ)@100MHz | 5 % | 68 nH | 300 mA | 800 mOhm | 1.03 mm | Ceramic | 0805 | Chip | 1.45 mm | ||
| 0 | - | 20(Typ)@100MHz | 5 % | 10 nH | 300 mA | 300 mOhm | 1.03 mm | Ceramic | 0805 | Chip | 1.45 mm |


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