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BNSCE201210 inductor surface mount Series

Multi - layer chip inductors for various applications

The BNSCE201210 inductor series from Bourns is a lineup of multi-layer chip inductors designed for a wide range of surface-mount applications. These components are commonly used in power supplies, switching regulators, and RF circuits due to their compact size and high-frequency performance. If you're working on projects that require small footprint inductors with good DC resistance and inductance stability, these are a solid choice.

One thing worth noting is that engineers tend to reach for this series when they need inductors that can handle higher currents without significant size increase. The multi-layer construction allows for better magnetic field containment, which is crucial in dense PCB layouts. Additionally, these inductors are known for their excellent temperature coefficient, making them reliable even under varying operating conditions. If you're facing issues with EMI in your designs, these inductors can help mitigate those problems by providing a low-profile solution with good shielding properties.

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BNSCE201210 inductor surface mount - Part List

13 parts in total

Inductance

Resistance - Initial (Ri) (Min)

Q @ Freq

Height

Mfr Part #Quantity AvailablePriceCategoryQ @ FreqToleranceInductanceCurrent Rating (Max)Resistance - Initial (Ri) (Min)HeightCore MaterialPackage / CaseTypeDepth
BNSCE20121012NJ
BNSCE20121012NJ

Ind Chip Multi-Layer 12nH 5% 100MHz 21Q-Factor Ceramic 300mA 0805 T/R

bourns

0-21(Typ)@100MHz5 %12 nH300 mA350 mOhm1.03 mmCeramic0805Chip1.45 mm
BNSCE20121047NJ
BNSCE20121047NJ

Ind Chip Multi-Layer 47nH 5% 100MHz 23Q-Factor Ceramic 300mA 0805 T/R

bourns

0-23(Typ)@100MHz5 %47 nH300 mA700 mOhm1.03 mmCeramic0805Chip1.45 mm
BNSCE20121027NJ
BNSCE20121027NJ

Ind Chip Multi-Layer 27nH 5% 100MHz 23Q-Factor Ceramic 300mA 0805 T/R

bourns

0-23(Typ)@100MHz5 %27 nH300 mA550 mOhm1.03 mmCeramic0805Chip1.45 mm
BNSCE20121082NJ
BNSCE20121082NJ

Ind Chip Multi-Layer 82nH 5% 100MHz 24Q-Factor Ceramic 300mA 0805 T/R

bourns

0-24(Typ)@100MHz5 %82 nH300 mA900 mOhm1.03 mmCeramic0805Chip1.45 mm
BNSCE2012104N7J
BNSCE2012104N7J

Ind Chip Multi-Layer 4.7nH 5% 100MHz 18Q-Factor Ceramic 300mA 0805 T/R

bourns

0-18(Typ)@100MHz5 %4.7 nH300 mA200 mOhm1.03 mmCeramic0805Chip1.45 mm
BNSCE201210R47J
BNSCE201210R47J

Ind Chip Multi-Layer 470nH 5% 50MHz 17Q-Factor Ceramic 300mA 0805 T/R

bourns

0-17(Typ)@100MHz5 %470 nH300 mA1.5 Ohm1.45 mmCeramic0805Chip-
BNSCE20121022NJ
BNSCE20121022NJ

Ind Chip Multi-Layer 22nH 5% 100MHz 23Q-Factor Ceramic 300mA 0805 T/R

bourns

0-23(Typ)@100MHz5 %22 nH300 mA500 mOhm1.03 mmCeramic0805Chip1.45 mm
BNSCE201210R10J
BNSCE201210R10J

Ind Chip Multi-Layer 100nH 5% 100MHz 23Q-Factor Ceramic 300mA 0805 T/R

bourns

0-23(Typ)@100MHz5 %100 nH300 mA900 mOhm1.2 mmCeramic0805Chip1.45 mm
BNSCE201210R15J
BNSCE201210R15J

Ind Chip Multi-Layer 150nH 5% 50MHz 22Q-Factor Ceramic 300mA 0805 T/R

bourns

0-22(Typ)@100MHz5 %150 nH300 mA1 Ohm1.2 mmCeramic0805Chip1.45 mm
BNSCE20121033NJ
BNSCE20121033NJ

Ind Chip Multi-Layer 33nH 5% 100MHz 24Q-Factor Ceramic 300mA 0805 T/R

bourns

0-24(Typ)@100MHz5 %33 nH300 mA600 mOhm1.03 mmCeramic0805Chip1.45 mm
BNSCE20121015NJ
BNSCE20121015NJ

Ind Chip Multi-Layer 15nH 5% 100MHz 22Q-Factor Ceramic 300mA 0805 T/R

bourns

0-22(Typ)@100MHz5 %15 nH300 mA400 mOhm1.03 mmCeramic0805Chip1.45 mm
BNSCE20121068NJ
BNSCE20121068NJ

Ind Chip Multi-Layer 68nH 5% 100MHz 25Q-Factor Ceramic 300mA 0805 T/R

bourns

0-25(Typ)@100MHz5 %68 nH300 mA800 mOhm1.03 mmCeramic0805Chip1.45 mm
BNSCE20121010NJ
BNSCE20121010NJ

Ind Chip Multi-Layer 10nH 5% 100MHz 20Q-Factor Ceramic 300mA 0805 T/R

bourns

0-20(Typ)@100MHz5 %10 nH300 mA300 mOhm1.03 mmCeramic0805Chip1.45 mm
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