- Home
- Product Categories
cigen-CIL21J
CIL21J inductor surface mount Series
Shielded multi - layer inductor chips for electronics
The CIL21J series from Samsung is a line of shielded multi-layer inductors designed for surface-mount applications. These inductors are typically used in high-frequency circuits, power supplies, and RF filtering applications where space is limited and electromagnetic interference (EMI) suppression is critical. If you're working on designs that require compact, high-performance inductors with good EMI characteristics, these components are a solid choice.
One thing worth noting is their ability to provide excellent shielding against magnetic fields. This makes them particularly useful in environments where EMI compliance is a concern, such as in consumer electronics or medical devices. Engineers tend to reach for this when they need to fit a lot of functionality into a small form factor while maintaining performance and minimizing interference.
Another practical benefit is their robustness and reliability. They are designed to handle high currents and operate efficiently over a wide temperature range, making them suitable for both consumer and industrial applications. Their multi-layer construction also contributes to their stability and consistent performance across different manufacturing batches.
Documents & Media
Frequently Asked Questions
CIL21J inductor surface mount - Part List
9 parts in total| Mfr Part # | Quantity Available | Price | Category | MOQ | Unit Pack | Standard Package | EU RoHS | Automotive | Qualification | Leadfree Defin | Protection Features | Q @ Freq | Tolerance | Inductance | Test Frequency | Current - Output | Voltage - Supply | DC Resistance (DCR) | Current Rating (Max) | Frequency - Self Resonant | Resistance - Initial (Ri) (Min) | Size | Depth | Width | Height | Length | Packaging | Core Material | Mounting Type | Package / Case | Length - Overall | Type | Design | Matchcode | Technology | Standard Leadtime | Temperature - Test | Operating Temperature | Rad Hardened | Military Standard | Current - DC Forward (If) (Max) | Diameter | Shielding | Failure Rate |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CIL21J1R0KNE Ind Chip Shielded Multi-Layer 1uH 10% 10MHz 45Q-Factor Ferrite 50mA 0805 Embossed T/R Inductor Chip Shielded Multi-Layer 1uH 10% 10MHz 45Q-Factor Ferrite 50mA 300mOhm DCR 0805 Embossed T/R CIL21J 1µH 50mA 10% MLT samsung electro-mechanics | 3200 | 1924: ¥0.0884 | - | 4000 | 4000 | Tape & Reel | Compliant | NO | 45 | RoHS-conform | Shielded | 45@10MHz | 10 % | 1 uH | 10MHz | 50mA | 75MHz | 0.3Ohm | 50 mA | 75 MHz | 300 mOhm | 0805Inch | 1.45 mm | 1.25mm | 1.05 mm | 2mm | Embossed Tape and Reel | Ferrite | SMD | 0805 | 2.2 mm | Chip | SHIELDED | INDC1,0U0805 | Multi-Layer | 14 weeks | -55°C | -55C to 125C | No | Not Required | 50 mA | Not Required mm | Shielded | Not Required |
CIL21J1R2KNE Ind Chip Shielded Multi-Layer 1.2uH 10% 10MHz 45Q-Factor Ferrite 50mA 0805 Embossed T/R Inductor Chip Shielded Multi-Layer 1.2uH 10% 10MHz 45Q-Factor Ferrite 50mA 400mOhm DCR 0805 Embossed T/R samsung electro-mechanics | 10 | 4000: ¥0.0768 | - | 40000 | 4000 | Tape & Reel | Compliant | NO | 45 | RoHS-conform | Shielded | 45@10MHz | 10 % | 1.2 uH | 10MHz | 50mA | 65MHz | 0.4Ohm | 50 mA | 65M | 400 mOhm | 0805Inch | 1.45 mm | 1.25mm | 1.05 mm | 2mm | Embossed Tape and Reel | Ferrite | SMD | 0805 | 2.2 | Chip | SHIELDED | INDC1,2U0805 | Multi-Layer | 14 weeks | -55°C | 125 | - | - | - | - | - | - |
CIL21J1R5KNE Ind Chip Shielded Multi-Layer 1.5uH 10% 10MHz 45Q-Factor Ferrite 50mA 0805 Embossed T/R Inductor Chip Shielded Multi-Layer 1.5uH 10% 10MHz 45Q-Factor Ferrite 50mA 400mOhm DCR 0805 Embossed T/R CIL21J 1,5uH 50mA 10% MLT samsung electro-mechanics | 10 | 4000: ¥0.0768 | - | 20000 | 4000 | Tape & Reel | Compliant | NO | 45 | RoHS-conform | Shielded | 45@10MHz | 10 % | 1.5 uH | 10MHz | 50mA | 60MHz | 0.4Ohm | 50 mA | 60M | 400 mOhm | 0805Inch | 1.45 mm | 1.25mm | 1.05 mm | 2mm | Embossed Tape and Reel | Ferrite | SMD | 0805 | 2.2 | Chip | SHIELDED | INDC1,5U0805 | Multi-Layer | 14 weeks | -55°C | 125 | - | - | - | - | - | - |
CIL21J1R8KNE Ind Chip Shielded Multi-Layer 1.8uH 10% 10MHz 45Q-Factor Ferrite 50mA 0805 Embossed T/R Inductor Chip Shielded Multi-Layer 1.8uH 10% 10MHz 45Q-Factor Ferrite 50mA 400mOhm DCR 0805 Embossed T/R samsung electro-mechanics | 4000 | 4000: ¥0.0748 | - | 40000 | 4000 | Tape & Reel | Compliant | NO | 45 | RoHS-conform | Shielded | 45@10MHz | 10 % | 1.8 uH | 10MHz | 50mA | 55MHz | 0.4Ohm | 50 mA | 55M | 400 mOhm | 0805Inch | 1.45 mm | 1.25mm | 1.05 mm | 2mm | Embossed Tape and Reel | Ferrite | SMD | 0805 | 2.2 | Chip | SHIELDED | INDC1,8U0805 | Multi-Layer | 14 weeks | -55°C | 125 | - | - | - | - | - | - |
CIL21J2R2KNE Ind Chip Shielded Multi-Layer 2.2uH 10% 10MHz 45Q-Factor Ferrite 30mA 0805 Embossed T/R Inductor Chip Shielded Multi-Layer 2.2uH 10% 10MHz 45Q-Factor Ferrite 30mA 500mOhm DCR 0805 Embossed T/R samsung electro-mechanics | 10 | 4000: ¥0.0768 | - | 20000 | 4000 | Tape & Reel | Compliant | NO | 45 | RoHS-conform | Shielded | 45@10MHz | 10 % | 2.2 uH | 10MHz | 30mA | 50MHz | 0.5Ohm | 30 mA | 50M | 500 mOhm | 0805Inch | 1.45 mm | 1.25mm | 1.05 mm | 2mm | Embossed Tape and Reel | Ferrite | SMD | 0805 | 2.2 | Chip | SHIELDED | INDC2,2U0805 | Multi-Layer | 14 weeks | -55°C | 125 | - | - | - | - | - | - |
CIL21J2R7KNE Ind Chip Shielded Multi-Layer 2.7uH 10% 10MHz 45Q-Factor Ferrite 30mA 0805 Embossed T/R Inductor Chip Shielded Multi-Layer 2.7uH 10% 10MHz 45Q-Factor Ferrite 30mA 600mOhm DCR 0805 Embossed T/R samsung electro-mechanics | 10 | 20000: ¥0.1004 | - | 20000 | 2000 | Tape & Reel | Compliant | NO | 45 | RoHS-conform | Shielded | 45@10MHz | 10 % | 2.7 uH | 10MHz | 30mA | 45MHz | 0.6Ohm | 30 mA | 45M | 600 mOhm | 0805Inch | 1.45 | 1.25mm | 1.45 mm | 2mm | Embossed Tape and Reel | Ferrite | SMD | 0805 | 2.2 | Chip | SHIELDED | INDC2,7U0805 | Multi-Layer | 14 weeks | -55°C | 125 | - | - | - | - | - | - |
CIL21J3R3KNE Ind Chip Shielded Multi-Layer 3.3uH 10% 10MHz 45Q-Factor Ferrite 30mA 0805 Embossed T/R Inductor Chip Shielded Multi-Layer 3.3uH 10% 10MHz 45Q-Factor Ferrite 30mA 600mOhm DCR 0805 Embossed T/R samsung electro-mechanics | 10 | 2000: ¥0.0816 | - | 10000 | 2000 | Tape & Reel | Compliant | NO | 45 | RoHS-conform | Shielded | 45@10MHz | 10 % | 3.3 uH | 10MHz | 30mA | 41MHz | 0.6Ohm | 30 mA | 41M | 600 mOhm | 0805Inch | 1.45 | 1.25mm | 1.45 mm | 2mm | Embossed Tape and Reel | Ferrite | SMD | 0805 | 2.2 | Chip | SHIELDED | INDC3,3U0805 | Multi-Layer | 14 weeks | -55°C | 125 | - | - | - | - | - | - |
CIL21J3R9KNE Ind Chip Shielded Multi-Layer 3.9uH 10% 10MHz 45Q-Factor Ferrite 30mA 0805 Embossed T/R Inductor Chip Shielded Multi-Layer 3.9uH 10% 10MHz 45Q-Factor Ferrite 30mA 800mOhm DCR 0805 Embossed T/R CIL21J 3,9µH 30mA 10% MLT samsung electro-mechanics | 10 | 40000: ¥0.1055 | - | 40000 | 2000 | Tape & Reel | Compliant | NO | 45 | RoHS-conform | Shielded | 45@10MHz | 10 % | 3.9 uH | 10MHz | 30mA | 38MHz | 0.8Ohm | 30 mA | 38M | 800 mOhm | 0805Inch | 1.45 | 1.25mm | 1.45 mm | 2mm | Embossed Tape and Reel | Ferrite | SMD | 0805 | 2.2 | Chip | SHIELDED | INDC3,9U0805 | Multi-Layer | 14 weeks | -55°C | 125 | - | - | - | - | - | - |
CIL21J4R7KNE Ind Chip Shielded Multi-Layer 4.7uH 10% 10MHz 45Q-Factor Ferrite 30mA 0805 Embossed T/R Inductor Chip Shielded Multi-Layer 4.7uH 10% 10MHz 45Q-Factor Ferrite 30mA 900mOhm DCR 0805 Embossed T/R CIL21J 4,7µH 30mA 10% MLT samsung electro-mechanics | 10 | 2000: ¥0.0707 | - | 10000 | 2000 | Tape & Reel | Compliant | NO | 45 | RoHS-conform | Shielded | 45@10MHz | 10 % | 4.7 uH | 10MHz | 30mA | 35MHz | 0.9Ohm | 30 mA | 35M | 900 mOhm | 0805Inch | 1.45 | 1.25mm | 1.45 mm | 2mm | Embossed Tape and Reel | Ferrite | SMD | 0805 | 2.2 | Chip | SHIELDED | INDC4,7U0805 | Multi-Layer | 14 weeks | -55°C | 125 | - | - | - | - | - | - |


samsung