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HI1005-1C1 inductor surface mount Series
Compact multilayer ceramic RF inductors for high-frequency applications
The HI1005-1C1 inductor from Advanced Ceramic X Corporation is a compact multilayer ceramic RF inductor designed for high-frequency applications. If you're working on RF circuits that need to operate above a few GHz, these inductors are a great choice. They offer a small footprint and excellent electrical performance, making them ideal for space-constrained designs such as mobile devices, wireless routers, and other portable electronics.
One thing worth noting is their stability under varying temperatures. Engineers tend to reach for these inductors when they need to maintain consistent performance across a wide range of operating conditions. The multilayer ceramic construction ensures that the inductance remains stable even when the temperature fluctuates, which is crucial in many RF applications where temperature variations can significantly impact performance.
Another practical benefit is their ability to handle higher power levels compared to some other surface-mount inductors. This makes them suitable for applications where you need to transmit or receive signals with significant power, without worrying about excessive heating or degradation of the component. Overall, the HI1005-1C1 inductor is a reliable choice for anyone looking to integrate high-frequency components into their design while maintaining both size and performance constraints.
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HI1005-1C1 inductor surface mount - Part List
6 parts in total| Mfr Part # | Quantity Available | Price | Category | Q @ Freq | Tolerance | Inductance | Current Rating (Max) | Resistance - Initial (Ri) (Min) | Height | Core Material | Package / Case | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
HI1005-1C1N5SMT Ind RF Chip Multi-Layer 1.5nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 0402 T/R advanced ceramic x corp. | 0 | - | 8@100MHz | 0.3 nH | 1.5 nH | 300 mA | 130 mOhm | 0.6 mm | Ceramic | 0402 | RF Chip | |
HI1005-1C1N8SMT Ind RF Chip Multi-Layer 1.8nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 0402 T/R advanced ceramic x corp. | 0 | - | 8@100MHz | 0.3 nH | 1.8 nH | 300 mA | 140 mOhm | 0.6 mm | Ceramic | 0402 | RF Chip | |
HI1005-1C15NJMT Ind RF Chip Multi-Layer 15nH 5% 100MHz 8Q-Factor Ceramic 250mA 0402 T/R advanced ceramic x corp. | 0 | - | 8@100MHz | 5 % | 15 nH | 250 mA | 600 mOhm | 0.6 mm | Ceramic | 0402 | RF Chip | |
HI1005-1C10NJMT HH:130.00786.005 IND 0402 10NH J TOL Ind RF Chip Multi-Layer 10nH 5% 100MHz 8Q-Factor Ceramic 250mA 0402 T/R advanced ceramic x corp. | 0 | - | 8@100MHz | 5 % | 10 nH | 250 mA | 450 mOhm | 0.6 mm | Ceramic | 0402 | RF Chip | |
HI1005-1C1N2SMT Ind RF Chip Multi-Layer 1.2nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 0402 T/R advanced ceramic x corp. | 0 | - | 8@100MHz | 0.3 nH | 1.2 nH | 300 mA | 120 mOhm | 0.6 mm | Ceramic | 0402 | RF Chip | |
HI1005-1C1N0SMT Ind RF Chip Multi-Layer 1nH 0.3nH 100MHz 8Q-Factor Ceramic 300mA 0402 T/R advanced ceramic x corp. | 0 | - | 8@100MHz | 0.3 nH | 1 nH | 300 mA | 120 mOhm | 0.6 mm | Ceramic | 0402 | RF Chip |


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