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HISDF1730 interconnect Series
Surface-mount board-to-board connectors with 0.5mm pitch
The HISDF1730 series from Hirose Electric Co., Ltd., are surface-mount board-to-board connectors designed for high-density interconnections with a 0.5mm pitch. These connectors are ideal for compact PCB designs where space is a critical factor, such as in portable electronics, medical devices, and industrial control systems. The small pitch allows for more pins in a given space, which is essential for applications requiring dense signal routing.
One thing worth noting is their robust design, which includes features like a double contact system to ensure reliable electrical connections even under mechanical stress. This is particularly useful in environments where the boards might experience vibration or shock. Engineers tend to reach for these connectors when they need to maintain high signal integrity in tight spaces without compromising on reliability.
Another practical benefit is their ease of assembly, thanks to the surface-mount technology. This makes them a popular choice for automated production lines where efficiency and consistency are key. The connectors also offer good insulation properties, which is crucial for preventing shorts between adjacent pins. Overall, the HISDF1730 series provides a solid solution for high-density interconnect needs in a variety of engineering projects.
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HISDF1730 interconnect - Part List
6 parts in total| Mfr Part # | Quantity Available | Price | Category | Pitch | Termination | Number of Rows | Number of Contacts | Type | Gender |
|---|---|---|---|---|---|---|---|---|---|
| 0 | - | 0.5 mm | Solder | 2 | 60 | Board to Board | RCP | ||
| 0 | - | 0.5 mm | Solder | 2 | 70 | Board to Board | RCP | ||
| 0 | - | 0.5 mm | Solder | 2 | 80 | Board to Board | RCP | ||
| 0 | - | 0.5 mm | Solder | 2 | 20 | Board to Board | RCP | ||
| 0 | - | 0.5 mm | Solder | 2 | 40 | Board to Board | RCP | ||
| 0 | - | 0.5 mm | Solder | 2 | 80 | Board to Board | RCP |


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