The ZW-10-13-F interconnect series from Samtec is a stackable through-hole board connector with a 2.54mm pitch, designed for high-density interconnections in various electronic assemblies. These connectors are particularly useful in applications requiring multiple signal and power connections, such as backplanes, motherboards, and multi-layer PCBs.

If you're working on systems that need to handle a lot of signals or power connections in a compact space, these connectors can be a great fit. They offer the flexibility to stack multiple connectors, which is invaluable for increasing density without sacrificing reliability. One thing worth noting is that they support both single-ended and differential signaling, making them versatile for a wide range of digital and analog applications.

Engineers tend to reach for this when they need a robust solution for stacking connectors in dense environments, like in servers, medical equipment, or industrial control systems. The 2.54mm pitch is a standard choice for many industry standards, ensuring compatibility with a broad range of PCB designs. Additionally, their stackability reduces the overall footprint compared to non-stackable solutions, which is a significant advantage in space-constrained designs.