EXB-SN96.5AG3.0CU0.5-0.5LB
| Category |
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Compliance
| Part Status | Active | ||
Mechanical
| Diameter | - | Packaging | Bulk |
| Wire Gauge | - | ||
Product Info
| Form | Bar, 0.5 lb (227g) | Type | Bar Solder |
| Series | Super Low Dross™ | Process | Lead Free |
| Flux Type | - | Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Manufacturer | Chip Quik Inc. | Base Product Number | EXB-SN96 |
Environmental
| Shelf Life | - | Melting Point | 423 ~ 428°F (217 ~ 220°C) |
| Shelf Life Start | - | Storage/Refrigeration Temperature | - |
Documents & Media
PDF Document
PDF Document
Sourcing & traceability
- Datasheet
- Datasheets
Lot-level traceability (date code, original factory packaging) is confirmed on every quote and shipment.