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PA0026C

Manufacturer
Description
UMAX-8/USOP-8/MSOP-8 TO DIP-8 SM
Category
对参数有疑问?问 AI 助手

Compliance

Part StatusActive

Mechanical

Pitch0.026" (0.65mm)MaterialFR4 Epoxy Glass
PackagingBulkBoard Thickness0.063" (1.60mm)
Package AcceptedMSOP, uMAX, uSOPSize / Dimension0.400" L x 0.400" W (10.16mm x 10.16mm)
Number of Positions8

Product Info

SeriesProto-AdvantageManufacturerChip Quik Inc.
Proto Board TypeSMD to DIPBase Product NumberPA0026

Documents & Media

PDF Document
PDF Document