SMD4300SNL250T4
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Specifications
| Form | Jar, 8.8 oz (250g) | Type | Solder Paste |
| Series | CHIPQUIK® SMD4300 | Weight | 0.551 lb (249.93 g) |
| Process | Lead Free | Diameter | - |
| Flux Type | No-Clean, Water Soluble | Mesh Type | 4 |
| Packaging | Bulk | Shelf Life | 6 Months |
| Wire Gauge | - | Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Part Status | Active | Manufacturer | Chip Quik Inc. |
| Melting Point | 423 ~ 428°F (217 ~ 220°C) | Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
| Digi-Key Storage | Refrigerated | Shelf Life Start | Date of Manufacture |
| Base Product Number | SMD4300 | Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |