WS991SNL500T4
| Category |
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Compliance
| Part Status | Active | ||
Mechanical
| Diameter | - | Packaging | Bulk |
| Wire Gauge | - | ||
Product Info
| Form | Jar, 17.64 oz (500g) | Type | Solder Paste |
| Series | CHIPQUIK® | Process | Lead Free |
| Flux Type | Water Soluble | Mesh Type | 4 |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Manufacturer | Chip Quik Inc. |
| Base Product Number | WS991 | ||
Environmental
| Shelf Life | 6 Months | Melting Point | 423°F (217°C) |
| Shelf Life Start | Date of Manufacture | ||
Documents & Media
Sourcing & traceability
- Datasheet
- Datasheets
Lot-level traceability (date code, original factory packaging) is confirmed on every quote and shipment.

