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HISFX880SSV22
| Manufacturer | |
| Description | Conn Board to Board RCP 80 POS 0.6mm Solder ST SMD Embossed T/R |
| Category |
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机械参数
| 间距 | 0.6 mm | 端接方式 | Solder |
| 接触镀层 | Gold | 排数 | 2 |
| 触点数 | 80 | ||
产品信息
| 类型 | Board to Board | 连接器性别 | RCP |
Documents & Media
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| Manufacturer | |
| Description | Conn Board to Board RCP 80 POS 0.6mm Solder ST SMD Embossed T/R |
| Category |
| 间距 | 0.6 mm | 端接方式 | Solder |
| 接触镀层 | Gold | 排数 | 2 |
| 触点数 | 80 | ||
| 类型 | Board to Board | 连接器性别 | RCP |