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EP3C25F256I7
| Category |
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Business
| Product | Cyclone III | Standard Package | 90 |
| Factory Pack Quantity | 90 | Standard Package Name | BGA |
Compliance
| RoHS | Contains lead / RoHS non-compliant | EU RoHS | Not Compliant |
Electrical
| Memory | 608256 | Memory Size | 608256 bit |
| Number of I/O | 156 | Frequency - Max | 315 MHz |
| Voltage - Supply | 1.15 V ~ 1.25 V | Voltage - Supply (Min) | 1.25 |
| Common Mode Transient Immunity (Min) | Industrial | ||
Mechanical
| Width | 17 | Packaging | Tray |
| Lead Style | Ball | Mounting Type | Surface Mount |
| Mounting Style | SMD/SMT | Package / Case | 256-LBGA |
| Length - Overall | 17 | Package Quantity | TFBGA |
| Number of Positions | 256 | Shell Size - Insert | 1.05 |
| Supplier Device Package | 256-FBGA (17x17) | ||
Product Info
| Series | Cyclone III | Process | 65nm |
| Manufacturer | Intel / Altera | Total RAM Bits | 608256 |
| RF Family/Standard | Cyclone® III | Number of LABs/CLBs | 1539 |
| Printed Circuit Board | 256 | Number of Inputs and Type | 156 |
| Number of Logic Elements/Cells | 24624 | Number of Logic Elements/Blocks | 24624 |
Environmental
| Operating Temperature | -40°C ~ 100°C | ||
Documents & Media
PDF Document
PDF Document
PDF Document
PDF Document
PDF Document
Similar Parts
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Sourcing & traceability
- Datasheet
- Cyclone III Device Handbook
Lot-level traceability (date code, original factory packaging) is confirmed on every quote and shipment.