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RE900-01
| Category |
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Compliance
| RoHS | RoHS Compliant Part | SVHC | :No SVHC (20-Jun-2013) |
| Tariff No | 85340019 | Material Flammability Rating | FR4 |
Mechanical
| Size | :43.5 x 29.0 mm | Pitch | 0.4 x 0.4mm |
| Width | 29mm | Length | 43.5mm |
| Weight | 0.004 | Material | :Epoxied FR4 |
| Footprint | :TSOP-1, 28-60 Pin | Thickness | 1.5mm |
| Height (Max) | :29mm | Hole Diameter | 1mm |
| Board Thickness | :SMD Device Adapter | Material - Body | :FR4 Epoxy Fibreglass |
| Material - Core | gold plated soldering pads | Package Quantity | 10 |
| Primary Material | Epoxy Glass Fabric Laminate | Size / Dimension | 43.5 x 29 x 1.5mm |
| Number of Positions | 2 | Plating - Thickness | 35µm |
| Contact Finish Thickness | :chem. Au 0.08 - 0.1 µm | Diameter - Inside, Non-Expanded | :1.5mm |
Product Info
| Spg | 10 | Copper Ports | 35µm |
| Number of Units | 1 | Module/Board Type | universal |
| Chemical Component | TSOP I | Base Product Number | multiadapter |
| Number of Positions Loaded | :2 | ||
