ONEIC.US
RE900-02

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Compliance

RoHSRoHS Compliant PartSVHC:No SVHC (20-Jun-2013)
Tariff No85340019Material Flammability RatingFR4

Mechanical

Size:30.5 x 43.5 mmPitch0.5 x 0.5mm
Width30.5mmLength43.5mm
Weight0.004Material:Epoxied FR4
Footprint:TSOP-1, 28-48 PinThickness1.5mm
Height (Max):30.5mmHole Diameter1mm
Board Thickness:SMD Device AdapterMaterial - Body:FR4 Epoxy Fibreglass
Material - Coregold plated soldering padsPackage Quantity10
Primary MaterialEpoxy Glass Fabric LaminateSize / Dimension43.5 x 30.5 x 1.5mm
Number of Positions2Plating - Thickness1.5µm
Contact Finish Thickness:chem. Au 0.08 - 0.1 µmDiameter - Inside, Non-Expanded:1.5mm

Product Info

Spg10Copper Ports35µm
Number of Units1Module/Board Typeuniversal
Chemical ComponentTSOP IBase Product Numbermultiadapter
Number of Positions Loaded:2

Documents & Media

PDF Document

Sourcing & traceability

Datasheet
79834.pdf

Lot-level traceability (date code, original factory packaging) is confirmed on every quote and shipment.