点击放大查看
RE931-03
| Category |
对参数有疑问？问 AI 助手
Compliance
| SVHC | :No SVHC (20-Jun-2013) | Tariff No | 85340019 |
| Material Flammability Rating | FR4 | ||
Mechanical
| Size | :20.0 x 23.5 mm | Pitch | 0.65 x 0.65mm |
| Width | 20mm | Length | 23.5mm |
| Weight | 0.0008 | Material | :Epoxied FR4 |
| Footprint | :SSOP-20 | Thickness | 1.5mm |
| Height (Max) | :20mm | Hole Diameter | 1mm |
| Board Thickness | :SMD Device Adapter | Material - Body | :FR4 Epoxy Fibreglass |
| Material - Core | gold plated soldering pads | Package Quantity | 10 |
| Primary Material | Epoxy Glass Fabric Laminate | Size / Dimension | 23.5 x 20 x 1.5mm |
| Number of Positions | 2 | Plating - Thickness | 35µm |
| Contact Finish Thickness | :chem. Au 0.08 - 0.1 µm | Diameter - Inside, Non-Expanded | :1.5mm |
Product Info
| Spg | 10 | Copper Ports | 35µm |
| Configuration | SSOP20 | Number of Units | 1 |
| Module/Board Type | universal | Chemical Component | SSOP |
| Base Product Number | multiadapter | Number of Positions Loaded | :2 |
