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5536407-5
| Category |
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Business
| Standard Pack | 30 | Standard Package | Bulk |
Compliance
| RoHS | Lead free / RoHS Compliant | Leadfree Defin | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
| RoHSELV Compliance | RoHS compliant, ELV compliant | Material Flammability Rating | UL 94V-0 |
Electrical
| Interface | Eurocard/DIN 41612 | Voltage - Supply | 250 |
| Current Rating (Max) | 1.5 | ||
Mechanical
| Size | Half | Color | Gray |
| Pitch | 2.54 mm | Height | 11.1 mm [ .437 in ] |
| Coating | Without | Packaging | Bulk |
| Termination | Solder | Contact Size | 0.64 [.025] Sq. |
| Contact Type | Solder Post | Mounting Type | Through Hole |
| Connector Type | Plug, Male Pins | Contact Finish | Tin |
| Mounting Style | 带有 | Number of Rows | A, B, C |
| Terminal Style | .64 x .64 mm [ .025 x .025 in ] | Insert Material | 铜合金 |
| Contact Material | Copper Alloy | Housing Material | Polymer |
| Mounting Feature | With | Panel Mount Type | 通孔 - 焊接 |
| Make Before Break | No | Termination Style | Solder Pin |
| Number of Contacts | 48 | Number of Positions | 48 |
| Contact Length - Post | 3.3 mm [ .13 in ] | Material - Insulation | Polymer Thermoplastic, Glass Filled |
| Mounting Hole Diameter | 带有 | Contact Finish - Mating | 锡 |
| Termination Post Length | 3.30 [0.130] | Contact Finish Thickness | 2.54 – 5.08 µm [ 100 – 200 µin ] |
Product Info
| Type | DIN 41612 | Grade | II |
| Style | 1/2 C | Gender | Plug |
| Series | 5536407 | Features | Board Lock |
| Guide Method | Without | Product Type | Type C Connectors |
| Connection Type | Printed Circuit Board | Number of Columns | 16 |
| Tool Type Feature | No | Number of Positions Loaded | All |
Environmental
| Temperature | No | Level, Class | 2 |
| Operating Temperature | -55°C ~ 125°C | Thermal Resistance of Package | 1.57 mm [ .062 in ] |
Documents & Media
Online Document
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Sourcing & traceability
- Datasheet
- 5536407-5?RQPN=5536407-5
Lot-level traceability (date code, original factory packaging) is confirmed on every quote and shipment.

