TC58NYG0S3EBAI4
| Category |
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Business
| Standard Package | Trays | Standard Package Name | BGA |
Compliance
| EU RoHS | Supplier Unconfirmed | FWFT Support | Yes |
Electrical
| Voltage | 1.7 to 1.95 | Interface | Serial |
| Voltage Rating | 1.8 V | Voltage - Supply | No |
| Current Rating (Max) | 30 | Voltage - Supply (Min) | 1.95 |
| Number of Bits per Element | 8 | ||
Mechanical
| Size | 2112 byte | Width | 9 |
| Lead Style | Ball | Mounting Type | Surface Mount |
| Package / Case | 63TFBGA | Length - Overall | 11 |
| Package Quantity | TFBGA | Primary Material | SLC NAND |
| Number of Positions | 63 | Shell Size - Insert | 0.7(Max) |
Product Info
| Density | 1 Gb | Sector Size | 128Kbyte x 1024 |
| Architecture | Sectored | Number of Words | 128M |
| Memory Organization | Symmetrical | Number of Addresses | 1 Bit |
| Printed Circuit Board | 63 | Timing Adjustment Method | Synchronous |
Environmental
| Operating Temperature | -40 to 85 °C | ||