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Kingston Technology Company, Inc.

Kingston Technology Company, Inc.- Tantalum Capacitors

Kingston Technology Company, Inc., commonly known as Kingston, was founded in 1987 and is headquartered in Fountain Valley, California, USA. The company is the world’s largest independent manufacturer of memory products and a leading provider of storage solutions. Kingston’s core business encompasses DRAM memory modules, solid-state drives (SSDs), USB flash drives, and memory cards for consumer, enterprise, and industrial applications. Its DRAM product lines include ValueRAM for standard systems, the high-performance FURY series (formerly HyperX) for gaming, and server-class modules for data centers. The company’s flash storage portfolio features a wide array of SSDs, such as the NV1, KC3000, and DataTraveler USB drives, as well as Canvas series memory cards. Kingston also offers embedded memory and eMMC/UFS solutions for mobile and IoT devices, extending its reach into the semiconductor ecosystem. With over 2,400 employees globally, Kingston ships to customers in more than 175 countries and has manufacturing and testing facilities in the US, Taiwan, and China. The company has consistently held a dominant market share in the memory module market, often ranking first in DRAM module and SSD channel shipments according to industry analysts. Kingston is recognized for its rigorous product testing, superior reliability, and lifetime warranties on many products, which have built strong customer loyalty. In 2007, Kingston’s annual revenue exceeded US$4.5 billion, and it has since grown significantly, while being named a “Best Company to Work For” by Fortune magazine.

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Tantalum Capacitors - 型号列表

2 parts in total

Voltage

Tolerance

Capacitance

Number of Elements

ESR (Equivalent Series Resistance)

Package / Case

Length - Overall

Density

Manufacturer

Mfr Part #Quantity AvailablePriceStandard PackageStandard Package NameEU RoHSMilitary StandardVoltageToleranceClock RateCapacitanceVoltage RatingNumber of ElementsVoltage - Supply (Min)ESR (Equivalent Series Resistance)HeightLead StyleConstructionMounting TypePackage / CasePackage CooledLength - OverallPackage QuantityNumber of PositionsShell Size - InsertNumber of Cores/Bus WidthDensityMain PurposeManufacturerSub-CategoryModule/Board TypePrinted Circuit BoardNumber of Logic Elements/CellsOperating TemperatureDepth
KHX1600C9D3B1K2/8GX
KHX1600C9D3B1K2/8GX

Cap Tant Solid 100uF 10V H CASE 5% (7.24 X 3.81 X 2.79mm) SMD (0.01%FR) T/R DRAM Module DDR3 SDRAM 8Gbyte 240DIMM

kingston technology

-TraysDIMMSupplier UnconfirmedMIL-PRF-55365/1310 Vdc5 %1600100 uF1.425321.5750.9 Ohm2.79 mmNo LeadFlatSocketHFBGA7.24 mmDIMM24030648GbyteDRAM Module512Mx64x2DDR3 SDRAM240DIMM2402G125 °C3.81 mm
KHX1600C9D3B1/4G
KHX1600C9D3B1/4G

Cap Tant Solid 150uF 6V G CASE 20% (6.73 X 2.79 X 2.79mm) SMD (0.1%FR) T/R DRAM Module DDR3 SDRAM 4Gbyte 240DIMM

kingston technology

-TraysDIMMSupplier UnconfirmedMIL-PRF-55365/136 Vdc20 %1600150 uF1.425161.5751.1 Ohm2.79 mmNo LeadFlatSocketGFBGA6.73 mmDIMM24030644GbyteDRAM Module512Mx64DDR3 SDRAM240DIMM2402G125 °C-
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