
点击放大查看
1-390261-3
| Manufacturer | |
| Description | Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN IC SOCKET VERT 14POS TIN 14 way Augat tin plate DIL socket,0.3in IC & Component Sockets 14P ECONOMY TIN Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 14Row-to-Row Spacing = 7.62 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, SOCKET IC, DIL, 0.3", 14WAY Socket,DIP;14Pins;DualLeaf;EconomyLadder;0.3In.;PhosphorBronze;Tin/Lead |
| Category |
Business
| Product | DIP / SIP Sockets | Product Category | IC & Component Sockets |
| Standard Package | Rail / Tube | Factory Pack Quantity | 3400 |
Compliance
| RoHS | Lead free / RoHS Compliant | EU RoHS | Compliant |
| Tariff No | 85369010 | Rad Hardened | No |
| Leadfree Defin | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c | RoHSELV Compliance | RoHS compliant, ELV compliant |
Electrical
| Voltage Rating | 250 V ac | Contact Resistance | 30 |
| Current Rating (Max) | 1A | Insulation Resistance | 10,000 |
| Voltage - Input (Min) | 250VAC | Connector - Voltage Input | :DIP |
Mechanical
| Depth | 10mm | Pitch | 2.54 mm |
| Width | 5.1mm | Height | 5.1 mm |
| Length | 17.78mm | Weight | 0.01 |
| Base Type | Ladder Frame | Packaging | Tube |
| Row Spacing | 7.62mm | Shell Style | Ladder |
| Termination | Solder | Contact Type | Dual Leaf |
| Lead Spacing | :2.54mm | Pitch - Post | 7.62 [0.300] |
| Mounting Type | Through Hole | Connector Type | :DIP |
| Contact Finish | Tin Over Nickel | Mounting Style | Vertical |
| Number of Rows | 2 | Package / Case | DIP |
| Insertion Force | 300g | Profile (W x H) | Standard |
| Contact Material | Phosphor Bronze | Housing Material | Polybutylene Terephthalate |
| Length - Overall | 17.78 mm | Package Quantity | Tube |
| Size / Dimension | 17.78 x 5.1 x 10mm | Termination Style | Solder Tail |
| Height Above Board | 5.10 [0.200] | Number of Contacts | 14 |
| Contact Termination | :Through Hole Vertical | Insulation Material | Polybutylene Terephthalate |
| Number of Positions | 14 | Center Contact Material | 2.54 [0.100] |
| Termination Post Length | 3.00 [0.118] | Contact Finish Thickness | 60µin (1.52µm) |
| 1st Connector Mounting Type | :PC Board | Number of Positions or Pins (Grid) | 14 (2 x 7) |
Product Info
| Type | DIP Socket | Gender | SKT |
| Series | :- | Features | Open Frame |
| CAD Drawing | 3D CAD Model | Product Type | DIP Socket |
| Other Specifications | Straight | ||
Environmental
| Temperature Range | -40 â +105 | Operating Temperature | +105°C |
Documents & Media
Similar Parts

1-390261-3
te connectivity / amp
Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN IC SOCKET VERT 14POS TIN 14 way Augat tin plate DIL socket,0.3in IC & Component Sockets 14P ECONOMY TIN Conn DIP Socket SKT 14 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 14Row-to-Row Spacing = 7.62 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, SOCKET IC, DIL, 0.3", 14WAY Socket,DIP;14Pins;DualLeaf;EconomyLadder;0.3In.;PhosphorBronze;Tin/Lead

2227MC-14-03-10-F1
Avnet, Inc.
SOCKET IC, DIL, 0.3", 14WAY

SPC15564
Avnet, Inc.
DIP SOCKET, 14POS, SURFACE MOUNT
SPC22186
Avnet, Inc.

629443
MULTICORE (SOLDER)
SOLDER WIRE, 80/18/2, 0.91MM, 500G

