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HYNH55S Series

Low-power mobile SDRAM chips in compact FBGA packages

The HYNH55S series from SK hynix is a lineup of low-power mobile SDRAM chips designed for compact form factors, specifically in fine-pitch ball-grid array (FBGA) packages. These chips are ideal for portable devices like smartphones and tablets where power efficiency and space constraints are critical. If you're working on next-generation mobile devices, these chips could be a key component to improve overall system performance while maintaining battery life.

One thing worth noting is their ability to operate efficiently under varying power conditions, which is crucial for mobile devices that can experience significant changes in power consumption depending on usage scenarios. Engineers tend to reach for this when they need a reliable, low-power memory solution that fits into tight spaces without compromising on performance. Another practical benefit is their compatibility with existing mobile device architectures, making them a straightforward upgrade path for manufacturers looking to enhance their products without major redesigns.

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Frequently Asked Questions

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HYNH55S - Part List

8 parts in total

Clock Rate

Access Time

Density

Number of Addresses

Mfr Part #Quantity AvailablePriceCategoryClock RateAccess TimeVoltage - SupplyPackage / CaseTypeDensityNumber of AddressesOperating Temperature
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HYNH55S5162DFR75M
HYNH55S5162DFR75M

DRAM Chip Mobile SDRAM 512M-Bit 32Mx16 1.8V 54-Pin FBGA

hynix

0-133 MHz6 ns1.8 V54FBGAMobile SDRAM512 Mb13 Bit-30 to 85 °C
HYNH55S1262EFP60M
HYNH55S1262EFP60M

DRAM Chip Mobile SDRAM 128M-Bit 2Mx16 1.8V 54-Pin FBGA

hynix

0-166 MHz5.4 ns1.8 V54FBGAMobile SDRAM128 Mb12 Bit-30 to 85 °C
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